423K Wakefield Thermal Solutions, 423K Datasheet
423K
Manufacturer Part Number
423K
Description
HEATSINK POWER NO MNT HOLES BLK
Manufacturer
Wakefield Thermal Solutions
Series
423r
Specifications of 423K
Height
2.62" (66.55mm)
Color
Black
Package Cooled
TO-3
Attachment Method
Press Fit
Outline
139.70mm x 120.65mm
Power Dissipation @ Temperature Rise
50W @ 47°C
Thermal Resistance @ Forced Air Flow
0.5°C/W @ 250 LFM
Thermal Resistance @ Natural
0.96°C/W
Product
Heatsinks
Mounting Style
Screw
Heatsink Material
Aluminum
Fin Style
Unidirectional Fin
Dimensions
140.2 mm L x 120.7 mm W x 66.7 mm H
Designed For
TO-3, DO-5, Stud Mounted Semiconductor Cases
Packages Cooled
TO-3
Thermal Resistance
47°C/W
Width
120.7mm
Heat Sink Material
Aluminum
Length
140.2mm
Mounting Type
PC Board Through Hole
Size
2.625H X 4.750W"
Package / Case
TO-3
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Other names
345-1050
423-K
423-K
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423K Summary of contents
Page 1
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Page 2
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Page 3
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Page 4
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Page 5
EXTRUDED HEAT SINKS FOR POWER SEMICONDUCTORS PERFORMANCE, LOW PROFILE HEAT SINKS FOR POWER MODULES & IGBT’S ...
Page 6
EXTRUDED HEAT SINKS FOR DC/DC CONVERTERS ...
Page 7
EXTRUDED HEAT SINKS FOR DC/DC CONVERTERS ...
Page 8
EXTRUDED HEAT SINKS FOR DC/DC CONVERTERS ...