218-40CT5 Wakefield Thermal Solutions, 218-40CT5 Datasheet - Page 3
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218-40CT5
Manufacturer Part Number
218-40CT5
Description
HEATSINK ALUM NATURAL SMD
Manufacturer
Wakefield Thermal Solutions
Series
218r
Specifications of 218-40CT5
Height
0.4" (10.16mm)
Package Cooled
SMD
Attachment Method
SMD Pad
Outline
26.16mm x 12.70mm
Power Dissipation @ Temperature Rise
2W @ 52°C
Thermal Resistance @ Forced Air Flow
21°C/W @ 200 LFM
Thermal Resistance @ Natural
31°C/W
Packages Cooled
TO-218 / TO-220
Thermal Resistance
31°C/W
Width
26.2mm
Heat Sink Material
Copper
Mounting Type
PC Board Surface Mount
Length
12.7mm
Body Plating
Matte Tin
Product
Heatsinks
Mounting Style
SMD/SMT
Heatsink Material
Aluminum
Fin Style
Folded
Dimensions
26.16 mm L x 12.7 mm W x 10.16 mm H
Designed For
SMT Devices
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Other names
21840CT5
345-1083
345-1083
WTS001_p1-25
BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS
24
MECHANICAL DIMENSIONS
PATENT PENDING
Board Level
Heat Sinks
Dimensions: in. (mm)
234 SERIES
MECHANICAL DIMENSIONS
234-75AB
6/14/07
Standard
P/N
230-75AB
230-75ABE-01
230-75ABE-05
230-75ABE-10
234-75AB
234-75ABE-01
234-75ABE-05
Material: Aluminum, Black Anodized
Standard
P/N
206-1PABEH
Material: Aluminum, Black Anodized
230 & 234 SERIES
206 SERIES
10:54 AM
230-75AB-01
Height Above
.750 (19.1)
.750 (19.1)
.500 (12.7)
.875 (22.2)
.790 (20.0)
.790 (20.0)
.500 (12.7)
PC Board
in. (mm)
Page 24
234-75AB-01
Vertical Mount Heat Sink
230-75AB-10
Height Above
Compact, Wavesolderable Low-Profile Self-Locking Heat Sinks
1.18 (30.0)
PC Board
in. (mm)
.570 (14.5) x .500 (12.7)
.570 (14.5) x .500 (12.7)
.750 (19.1) x .570 (14.5)
.570 (14.5) x .500 (12.7)
.570 (14.5) x .500 (12.7)
.570 (14.5) x .500 (12.7)
.790 (20.0) x .570 (14.5)
Dimensions
Footprint
in. (mm)
230 AND 234 SERIES
234-75AB-05
1.00 (25.4) x .50 (12.7)
Configuation
Vert./Horiz.
Vert./Horiz
Horizontal
Horizontal
Mounting
Maximum
Vertical
Vertical
Vertical
Footprint
in. (mm)
100
80
60
40
20
Solderable
0
230-75AB-05
Option
No Tab
No Tab
234 SERIES
0
0
Tab
01
05
10
01
05
CONVECTION CHARACTERISTICS
200
200
2
Natural Convection
NATURAL AND FORCED
56°C rise @ 4W
HEAT DISSIPATED (WATTS)
Clip/Mtg Hole
Clip/Mtg Hole
Clip/Mtg Hole
Clip/Mtg Hole
Clip/Mtg Hole
Clip/Mtg Hole
Clip/Mtg Hole
Mounting
AIR VELOCITY (LFM)
Style
400
400
4
Thermal Performance at Typical Load
CONVECTION CHARACTERISTICS
600
600
6
Thermal Performance at Typical Load
NATURAL AND FORCED
Convection
57°C @ 2W
57°C @ 2W
57°C @ 2W
57°C @ 2W
57°C @ 2W
57°C @ 2W
57°C @ 2W
Natural
800
800
8
230 SERIES
1000
1000
10
7.3°C/W @ 200LFM
Forced Convection
7.5°C/W @ 400 LFM
7.5°C/W @ 400 LFM
7.5°C/W @ 400 LFM
7.5°C/W @ 400 LFM
7.5°C/W @ 400 LFM
7.5°C/W @ 400 LFM
7.5°C/W @ 400 LFM
10
8
6
4
2
0
Convection)
Forced
TO-220
TO-220