628-65AB Wakefield Thermal Solutions, 628-65AB Datasheet - Page 6

• Manufacturer Part Number: 628-65AB
• Description: HEATSINK CPU 43MM SQ BLK H=.65"
• Manufacturer: Wakefield Thermal Solutions
• Series: 628r

Specifications of 628-65AB

• Height: 0.65" (16.5mm)
• Color: Black
• Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
• Attachment Method: Thermal Tape, Adhesive (Not Included)
• Outline: 44.45mm x 43.18mm
• Power Dissipation @ Temperature Rise: 4.5W @ 30°C
• Thermal Resistance @ Forced Air Flow: 1.5°C/W @ 400 LFM
• Product: Heatsinks
• Mounting Style: Screw
• Heatsink Material: Aluminum
• Fin Style: Omnidirectional Pin
• Dimensions: 44.45 mm L x 43.2 mm W x 16.5 mm H
• Designed For: BGA, Super BGA, PBGA, FPBGA
• Packages Cooled: PGA / LED
• Thermal Resistance: 3°C/W
• Width: 43.2mm
• Heat Sink Material: Aluminum
• Length: 44.5mm
• Mounting Type: Adhesive
• Size: 0.650H X 1.750W X 1.700L"
• Package / Case: PGA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Thermal Resistance @ Natural: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 345-1062

PENGUIN
Dimensions: in.
Normally stocked
MECHANICAL DIMENSIONS
MECHANICAL DIMENSIONS
609-50AB HEAT SINK
AND CLIP ASSEMBLY
™
COOLERS: HEAT SINKS FOR MICROPROCESSORS AND ASICs
609 SERIES
Standard
P/N
609-50AB
609-100AB
Notes: 1. Optional factory preapplied thermal interface material. Pages 74–76.
619 SERIES
Standard
P/N
61995AB124D1
61995AB054D1
Notes: 1. Optional factory preapplied thermal interface material. Pages 74–76.
FEATURES AND BENEFITS:
• Captivated clips for ease of assembly
• Low acoustic noise
(609-50AB)
Dimensions: in. (mm)
Pin Fin Heat Sink/Clip Assembly for PowerPC™ 601, 604 (304 C4QFP, 255 CBGA
Fan Heat Sink for BGA and PowerPC™ Packages
2.808 (71.32) x 1.700 (43.7)
2.871 (72.92) x 1.98 (50.29)
2.871 (72.92) x 1.98 (50.29)
2.895 (73.5) x 2.000 (50.8)
(609-100AB)
Base Dimensions
Base Dimensions
in. (mm)
in. (mm)
• Impingement air flow
• Accomodates BGA packages up to 45 mm in size
19
0.953 (24.21)
0.953 (24.21)
in. (mm)
Height
Dimensions “A”
0.500 (12.7)
1.00 (25.4)
in. (mm)
All other products, please contact factory for price, delivery, and minimums.
Black Anodized
Black Anodized
Heat Sink
Finish
FORCED CONVECTION THERMAL PERFORMANCE DATA
PRODUCT DESIGNATION
(FLOW PARALLEL TO EXTRUSION DIRECTION)
PRODUCT DESIGNATION
Black Anodized
Black Anodized
Integrated Circuit
Heat Sink
Finish
1.2 ± 0.1° C/W
1.2 ± 0.1° C/W
Heat Sinks
Performance
Thermal
BGA/Power PC
40mm C4QFP
21mm CBGA
lbs. (grams)
lbs. (grams)
0.094 (42.5)
0.130 (59.0)
.150 (68.10)
.150 (68.10)
Weight
Weight