628-65AB Wakefield Thermal Solutions, 628-65AB Datasheet - Page 8

• Manufacturer Part Number: 628-65AB
• Description: HEATSINK CPU 43MM SQ BLK H=.65"
• Manufacturer: Wakefield Thermal Solutions
• Series: 628r

Specifications of 628-65AB

• Height: 0.65" (16.5mm)
• Color: Black
• Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
• Attachment Method: Thermal Tape, Adhesive (Not Included)
• Outline: 44.45mm x 43.18mm
• Power Dissipation @ Temperature Rise: 4.5W @ 30°C
• Thermal Resistance @ Forced Air Flow: 1.5°C/W @ 400 LFM
• Product: Heatsinks
• Mounting Style: Screw
• Heatsink Material: Aluminum
• Fin Style: Omnidirectional Pin
• Dimensions: 44.45 mm L x 43.2 mm W x 16.5 mm H
• Designed For: BGA, Super BGA, PBGA, FPBGA
• Packages Cooled: PGA / LED
• Thermal Resistance: 3°C/W
• Width: 43.2mm
• Heat Sink Material: Aluminum
• Length: 44.5mm
• Mounting Type: Adhesive
• Size: 0.650H X 1.750W X 1.700L"
• Package / Case: PGA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Thermal Resistance @ Natural: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 345-1062

DELTEM
1 0 0
8 0
6 0
4 0
2 0
™
0
0
0
COMPOSITE HEAT SINKS FOR BGAs
200
0.25
HEAT DISSIPATED (WATTS)
AIR VELOCITY (LFM)
Available with pressure sensitive adhesives for quick and easy mounting. See Page 3
Available with pressure sensitive adhesives for quick and easy mounting. See Page 3
400
0.50
600
0.75
800
1.00
1000
1.25
3 0
2 5
2 0
1 5
1 0
5
0
1 0 0
8 0
6 0
4 0
2 0
0
0
0
200
0.25
HEAT DISSIPATED (WATTS)
AIR VELOCITY (LFM)
400
0.50
600
0.75
800
1.00
1000
1.25
1 6
1 4
1 2
1 0
8
6
4
2
0