625-25ABT-4E Wakefield Thermal Solutions, 625-25ABT-4E Datasheet - Page 19
625-25ABT-4E
Manufacturer Part Number
625-25ABT-4E
Description
BGA HEATSINK 25MM
Manufacturer
Wakefield Thermal Solutions
Series
625r
Datasheet
1.658-60ABT3.pdf
(19 pages)
Specifications of 625-25ABT-4E
Package Cooled
Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method
Thermal Tape, Adhesive (Not Included)
Outline
25.00mm x 25.00mm
Height
0.250" (6.35mm)
Product
Heatsinks
Mounting Style
Screw
Heatsink Material
Aluminum
Fin Style
Omnidirectional Pin
Dimensions
25 mm L x 25 mm W x 6.4 mm H
Designed For
BGA, Super BGA, PBGA, FPBGA
Color
Black
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Power Dissipation @ Temperature Rise
-
Thermal Resistance @ Forced Air Flow
-
Thermal Resistance @ Natural
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
18 x 18 PGA
17 x 17 SPGA
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