624-45AB-T4E Wakefield Thermal Solutions
624-45AB-T4E
Manufacturer Part Number
624-45AB-T4E
Description
HEATSINK CPU 21MM SQ
Manufacturer
Wakefield Thermal Solutions
Series
624r
Specifications of 624-45AB-T4E
Package Cooled
Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method
SMD Pad
Outline
21.00mm x 21.00mm
Height
0.45" (11.43mm)
Power Dissipation @ Temperature Rise
-
Thermal Resistance @ Forced Air Flow
-
Thermal Resistance @ Natural
-
Other names
Q3074584
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