655-53AB Wakefield Thermal Solutions, 655-53AB Datasheet - Page 5

HEATSINK CPU 40.6MM SQ H=.525"

655-53AB

Manufacturer Part Number
655-53AB
Description
HEATSINK CPU 40.6MM SQ H=.525"
Manufacturer
Wakefield Thermal Solutions
Series
655r
Datasheets

Specifications of 655-53AB

Height
0.52" (13.21mm)
Package Cooled
Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method
Thermal Tape, Adhesive (Not Included)
Outline
40.64mm x 40.64mm
Power Dissipation @ Temperature Rise
4W @ 40°C
Thermal Resistance @ Forced Air Flow
2°C/W @ 400 LFM
Packages Cooled
BGA / LED
Width
40.6mm
Heat Sink Material
Aluminum
Length
40.6mm
Mounting Type
Adhesive
Color
Black
Size
0.525H X 1.600W X 1.600L"
Package / Case
BGA
Product
Heatsinks
Mounting Style
SMD/SMT
Heatsink Material
Aluminum
Fin Style
Omnidirectional Pin
Dimensions
40.6 mm L x 40.6 mm W x 13.3 mm H
Designed For
BGA, Super BGA, PBGA, FPBGA, PowerPC
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Thermal Resistance @ Natural
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
345-1093
65553AB

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
655-53AB
Manufacturer:
WAK
Quantity:
2 457
Part Number:
655-53ABT3
Manufacturer:
WAK
Quantity:
500
All other products, please contact factory for price, delivery, and minimums.
Dimensions: in. (mm)
Dimensions: in. (mm)
MECHANICAL DIMENSIONS
MECHANICAL DIMENSIONS
MECHANICAL DIMENSIONS
Dimensions: in. (mm)
PENGUIN
Integrated Circuit
Heat Sinks
662 SERIES
Standard
P/N
662-15AG
Notes: 1. Optional factory preapplied pressure-sensitive adhesive. Pages 74–76.
628 SERIES
Standard
P/N
628-20AB
628-25AB
628-35AB
628-40AB
628-65AB
Notes: 1. Optional factory preapplied pressure-sensitive adhesive. Pages 74–76.
663 SERIES
Standard
P/N
663-35AB
Notes: 1. Optional factory preapplied pressure-sensitive adhesive. Pages 74–76.
COOLERS: HEAT SINKS FOR MICROPROCESSORS AND ASICs
Pin Fin Heat Sink for Limited Height Applications for Intel 80486DX, AMD A
Pin Fin Heat Sinks for IntelDX4™, Intel 80486DX2™, and A
Unidirectional Fin Heat Sink for Intel 80486DX/DX2™
1.750 (44.5) x 1.700 (43.2)
1.750 (44.5) x 1.700 (43.2)
1.750 (44.5) x 1.700 (43.2)
1.750 (44.5) x 1.700 (43.2)
1.750 (44.5) x 1.700 (43.2)
Base Dimensions
1.713 (43.5) sq
Base Dimensions
Base Dimensions
1.535 (39.0) sq
in. (mm)
in. (mm)
in. (mm)
NATURAL CONVECTION CHARACTERISTICS
18
KEY:
0.150 (3.8)
628-20AB
in. (mm)
Dimensions “A”
Dimensions “A”
Height
0.400 (10.2)
0.650 (16.5)
0.200 (5.1)
0.250 (6.4)
0.350 (8.9)
0.355 (9.0)
in. (mm)
in. (mm)
b
628-25AB
M
486™DX2, A
628-35AB
Black Anodized
Black Anodized
Black Anodized
Black Anodized
Black Anodized
Black Anodized
FORCED CONVECTION CHARACTERISTICS
Gold Iridite
Heat Sink
Heat Sink
CONVECTION CHARACTERISTICS
Heat Sink
Finish
Finish
Finish
CONVECTION CHARACTERISTICS
NATURAL AND FORCED
M
486™DX4
NATURAL AND FORCED
M
628-40AB
29030
628-65AB
lbs. (grams)663
Normally stocked
0.031 (14.17)
0.038 (17.01)
0.044 (19.84)
0.050 (22.68)
0.056 (25.51)
17 x 17 PGA
17 x 17 PGA
17 x 17 PGA
0.031 (14.17)
lbs. (grams)
0.019 (8.50)
lbs. (grams)
Weight
Weight
Weight

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