655-53AB Wakefield Thermal Solutions, 655-53AB Datasheet - Page 16

• Manufacturer Part Number: 655-53AB
• Description: HEATSINK CPU 40.6MM SQ H=.525"
• Manufacturer: Wakefield Thermal Solutions
• Series: 655r

Specifications of 655-53AB

• Height: 0.52" (13.21mm)
• Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
• Attachment Method: Thermal Tape, Adhesive (Not Included)
• Outline: 40.64mm x 40.64mm
• Power Dissipation @ Temperature Rise: 4W @ 40°C
• Thermal Resistance @ Forced Air Flow: 2°C/W @ 400 LFM
• Packages Cooled: BGA / LED
• Width: 40.6mm
• Heat Sink Material: Aluminum
• Length: 40.6mm
• Mounting Type: Adhesive
• Color: Black
• Size: 0.525H X 1.600W X 1.600L"
• Package / Case: BGA
• Product: Heatsinks
• Mounting Style: SMD/SMT
• Heatsink Material: Aluminum
• Fin Style: Omnidirectional Pin
• Dimensions: 40.6 mm L x 40.6 mm W x 13.3 mm H
• Designed For: BGA, Super BGA, PBGA, FPBGA, PowerPC
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Thermal Resistance @ Natural: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 345-1093; 65553AB

HEAT SINKS FOR BGAs, SUPER BGAs, PBGAs, and FPBGAs
8
7
6
5
4
3
2
1
0
3
2
1
0
5
4
100
100
200
200
300
300
AIR VELOCITY (LFM)
AIR VELOCITY (LFM)
400
400
500
500
600
600
700
700
3
2
1
0
3
100
8
7
6
5
4
3
2
1
0
3
2
1
0
5
4
3
2
1
0
7
6
5
4
3
2
1
0
100
100
100
100
200
200
200
200
200
300
AIR VELOCITY (LFM)
300
300
300
300
AIR VELOCITY (LFM)
AIR VELOCITY (LFM)
AIR VELOCITY (LFM)
AIR VELOCITY (LFM)
618-100AB
400
618-20AB
400
400
400
400
500
500
500
500
500
600
600
600
600
600
700
700
700
700
700