2283B Aavid Thermalloy, 2283B Datasheet
2283B
Manufacturer Part Number
2283B
Description
BOARD LEVEL HEAT SINK
Manufacturer
Aavid Thermalloy
Datasheet
1.2292BG.pdf
(3 pages)
Specifications of 2283B
Package Cooled
BGA
Attachment Method
Thermal Tape, Adhesive (Not Included)
Outline
16.64mm x 16.64mm
Height
0.265" (6.73mm)
Power Dissipation @ Temperature Rise
1W @ 40°C
Thermal Resistance @ Forced Air Flow
17.5°C/W @ 300 LFM
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Thermal Resistance @ Natural
-
Other names
34100
Heat Sinks by Product - radial fin
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Radial Fin Heat Sinks for Microprocessors
Part Number: 2283BG
Part Number: 2286BG<
Products
Bond-on heat sinks for leadless chip carriers and flat packs.
Primarily designed for 68-position devices.
The 2283 is ideally suited to limited board space applications with high air flow.
/
BGA
/
Radial Fins
---Useful Links---
6
Page 1 of 3
4/19/2010
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2283B Summary of contents
Page 1
... Search by part # Bond-on heat sinks for leadless chip carriers and flat packs. Primarily designed for 68-position devices. The 2283 is ideally suited to limited board space applications with high air flow. Check distributor part inventory Part Number: 2283BG Browse Heat sinks - By Device - Product Line - 6 ...
Page 2
Heat Sinks by Product - radial fin Part Number: 2288BG Part Number: 2292BG Part Number: 2296BG http://www.aavidthermalloy.com/products/bga/radial.shtml Page 4/19/2010 ...
Page 3
Heat Sinks by Product - radial fin http://www.aavidthermalloy.com/products/bga/radial.shtml Page 4/19/2010 ...