SP900S-0.009-00-104 Bergquist, SP900S-0.009-00-104 Datasheet
SP900S-0.009-00-104
Manufacturer Part Number
SP900S-0.009-00-104
Description
THERMAL PAD TO-247 .009" SP900
Manufacturer
Bergquist
Series
Sil-Pad® 900-Sr
Datasheets
1.803129.pdf
(27 pages)
2.SP900S-0.009-00-58.pdf
(1 pages)
3.SP900S-0.009-00-54.pdf
(1 pages)
Specifications of SP900S-0.009-00-104
Usage
TO-218, TO-220, TO-247
Shape
Rectangular
Outline
25.40mm x 19.05mm
Thickness
0.009" (0.229mm)
Backing, Carrier
Fiberglass
Color
Pink
Thermal Resistivity
0.61°C/W
Thermal Conductivity
1.6 W/m-K
Packages Cooled
TO-220 / TO-247 / TO-218
Operating Temperature Range
-60°C To +180°C
Svhc
No SVHC (18-Jun-2010)
Breakdown Voltage Vbr
5.5V
Colour
Mauve
Rohs Compliant
Yes
Dielectric Constant
6
External Depth
0.2mm
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Adhesive
-
Other names
BER178
SP900-104
SP900S-104
SP900-104
SP900S-104
Sil-Pad
High Performance Insulator for Low-Pressure Applications
Features and Benefits
• Thermal impedance:
• Electrically isolating
• Low mounting pressures
• Smooth and highly compliant surface
• General-purpose thermal interface
The true workhorse of the Sil-Pad product
family, Sil-Pad 900S thermally conductive
insulation material, is designed for a wide
variety of applications requiring high thermal
performance and electrical isolation.These
applications also typically have low mounting
pressures for component clamping.
Sil-Pad 900S material combines a smooth
and highly compliant surface characteristic
with high thermal conductivity.These features
optimize the thermal resistance properties at
low pressures.
Applications requiring low component clamp-
ing forces include discrete semiconductors
(TO-220,TO-247 and TO-218) mounted with
spring clips. Spring clips assist with quick
assembly and apply a limited amount of force
to the semiconductor.The smooth surface
texture of Sil-Pad 900S minimizes interfacial
thermal resistance and maximizes thermal
performance.
56
0.61°C-in
material solution
2
/W (@50 psi)
®
900S
Typical Applications Include:
• Power supplies
• Automotive electronics
• Motor controls
• Power semiconductors
Configurations Available:
• Sheet form, die-cut parts and roll form
• With or without pressure sensitive adhesive
Building a Part Number
Note: To build a part number, visit our website at www.bergquistcompany.com.
Sil-Pad
PROPERTY
Color
Reinforcement Carrier
Thickness (inch) / (mm)
Hardness (Shore A)
Elongation (%45° to Warp and Fill)
Tensile Strength (psi) / (MPa)
Continuous Use Temp (°F) / (°C)
ELECTRICAL
Dielectric Breakdown Voltage (Vac)
Dielectric Constant (1000 Hz)
Volume Resistivity (Ohm-meter)
Flame Rating
THERMAL
Thermal Conductivity (W/m-K)
THERMAL PERFORMANCE vs PRESSURE
1) The ASTM D5470 test fixture was used.The recorded value includes interfacial thermal resistance.These values are provided for
reference only. Actual application performance is directly related to the surface roughness, flatness and pressure applied.
SP900S
®
: U.S. Patents 4,574,879; 4,602,125; 4,602,678; 4,685,987; 4,842,911 and others
TO-220 Thermal Performance (°C/W)
–
Thermal Impedance (°C-in
0.009
TYPICAL PROPERTIES OF SIL-PAD 900S
Type 3 Electrodes
–
AC
–
00
–
Pressure (psi)
ACME 951753 Rev B
2
/W) (1)
IMPERIAL VALUE
-76 to 356
Fiberglass
0.009
1300
5500
8300
Pink
10
V-O
6.0
1.6
92
20
10
3.96
0.95
10
Standard Options
NA = Selected standard option. If not selecting a standard
option, insert company name, drawing number, and
revision level.
_ _ _ = Standard configuration dash number,
1212 = 12" x 12" sheets, 12/250 = 12" x 250' rolls, or
00 = custom configuration
AC = Adhesive, one side
00 = No adhesive
Standard thicknesses available: 0.009"
SP900S = Sil-Pad 900S Material
METRIC VALUE
3.41
0.75
25
-60 to 180
Fiberglass
0.229
5500
8300
Pink
V-O
10
6.0
1.6
92
20
9
10
2.90
0.61
50
TEST METHOD
2.53
0.47
100
ASTM D2240
ASTM D5470
ASTM D374
ASTM D412
ASTM D412
ASTM D149
ASTM D149
ASTM D150
ASTM D257
U.L. 94
Visual
—
—
2.32
0.41
200
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