CPU 1.375X1.375 Bergquist, CPU 1.375X1.375 Datasheet

CPU 1.375X1.375

Manufacturer Part Number

CPU 1.375X1.375

Description

THERM PAD CPU 1.375" X 1.375"

Manufacturer

Bergquist

Series

CPU Pad™r

Datasheet

1.CPU_1.375X1.375.pdf (1 pages)

Specifications of CPU 1.375X1.375

Usage

CPU

Shape

Square

Outline

34.93mm x 34.93mm

Thickness

0.005" (0.127mm)

Color

Tan

Thermal Conductivity

0.6 W/m-K

Lead Free Status / RoHS Status

Lead free / RoHS Compliant

Adhesive

Backing, Carrier

Thermal Resistivity

Other names

BER135

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electrically insulating, double coated tape. The tape consists

of a high performance acrylic, pressure sensitive adhesive, on

both sides of a ﬁlm. This product can be used in applications

that currently require clips. CPU Pad is typically used to

mount a heat sink on top of a central processing unit on the

circuit board.

Thermally Conductive Material for Cooling Central Processing Units

Bergquist CPU Pad is a thermally conductive,

CPU PAD

Color

Thickness

Tensile Strength

Elongation

Glass Transition

Adhesion to Aluminum

Adhesion to Liner

Tensile Shear

Thermal Conductivity

Thermal Resistance

Thermal Coefﬁcient of expansion 450 ppm

Time

Cycles

100

200

300

PROPERTY

Adhesion

Thermal Properties

Thermal Cycling 1 Hour at -50°C and 1 Hour at 150°C

TYPICAL PROPERTIES OF CPU Pad

™

TYPICAL

VALUE

Tan

.005 ±.001

5000 psi

40 %

-70 °C

4 lbs./in

16 g/inch

120 psi

0.6 W/m-K

0.3

PLI (N/cm)

3.6 (6.4)

3.8 (6.8)

4.5 (8.1)

4.7 (8.4)

Peel Adhesion

C-in

VALUE/ 5 MIL

METRIC

Tan

.127 mm

35 MPa

40 %

-70 °C

7 N/cm

6 N/m

.84 MPa

0.6 W/m-K

1.9 °Cmm

450 ppm

Voltage Breakdown

6000

Application Force for CPU Pad

CPU Pad is a high performance, acrylic, pressure sensitive

adhesive. Being pressure sensitive, the adhesive makes a

strong bond to surfaces with little or no pressure. Parts can

simply be assembled and placed on the CPU Pad.

Immediately after placement, the parts are securely bonded

together. No long clamping times or high pressures are

required.

Mounting Procedure

1. Insure cleanliness of central processing unit and

2. Remove the clear liner from one side of the CPU Pad.

3. Roll the pad onto the substrate.

4. Remove the white liner.

5. With moderate pressure (less than 10 psi), press the

heat sink.

part in place.

TYPICAL VALUE

9 MIL

Tan

.009 ± .001

-70 °C

2700 grams per in. ASTM D 1876

50 gr. grams per in. ASTM D 1876

140 psi

0.4 W/m-K

.42 °C-in

TEST

METHOD

Visual

ASTM D 374

ASTM D 412

TMA

ASTM D 1002

ASTM D5470

TMA

Pass

Visual

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