SP900S-0.009-00-43 Bergquist, SP900S-0.009-00-43 Datasheet

SP900S-0.009-00-43

Manufacturer Part Number

SP900S-0.009-00-43

Description

THERM PAD TO-220 CLIP .009" SP90

Manufacturer

Bergquist

Series

Sil-Pad® 900-Sr

Type

Thermal Padr

Datasheets

1.803129.pdf (27 pages)

2.SP900S-0.009-00-58.pdf (1 pages)

3.SP900S-0.009-00-54.pdf (1 pages)

Specifications of SP900S-0.009-00-43

Usage

TO-220

Shape

Rectangular

Outline

19.05mm x 12.70mm

Thickness

0.009" (0.229mm)

Backing, Carrier

Fiberglass

Color

Pink

Thermal Resistivity

0.61°C/W

Thermal Conductivity

1.6 W/m-K

Packages Cooled

TO-220

Breakdown Voltage Vbr

5.5kV

Operating Temperature Range

-60Â°C To +180Â°C

Lead Free Status / RoHS Status

Lead free / RoHS Compliant

Adhesive

Other names

BER174
SP900-43
SP900S-43

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Sil-Pad

High Performance Insulator for Low-Pressure Applications

Features and Benefits

• Thermal impedance:

• Electrically isolating

• Low mounting pressures

• Smooth and highly compliant surface

• General-purpose thermal interface

The true workhorse of the Sil-Pad product

family, Sil-Pad 900S thermally conductive

insulation material, is designed for a wide

variety of applications requiring high thermal

performance and electrical isolation.These

applications also typically have low mounting

pressures for component clamping.

Sil-Pad 900S material combines a smooth

and highly compliant surface characteristic

with high thermal conductivity.These features

optimize the thermal resistance properties at

low pressures.

Applications requiring low component clamp-

ing forces include discrete semiconductors

(TO-220,TO-247 and TO-218) mounted with

spring clips. Spring clips assist with quick

assembly and apply a limited amount of force

to the semiconductor.The smooth surface

texture of Sil-Pad 900S minimizes interfacial

thermal resistance and maximizes thermal

performance.

0.61°C-in

material solution

/W (@50 psi)

900S

Typical Applications Include:

• Power supplies

• Automotive electronics

• Motor controls

• Power semiconductors

Configurations Available:

• Sheet form, die-cut parts and roll form

• With or without pressure sensitive adhesive

Building a Part Number

Note: To build a part number, visit our website at www.bergquistcompany.com.

Sil-Pad

PROPERTY

Color

Reinforcement Carrier

Thickness (inch) / (mm)

Hardness (Shore A)

Elongation (%45° to Warp and Fill)

Tensile Strength (psi) / (MPa)

Continuous Use Temp (°F) / (°C)

ELECTRICAL

Dielectric Breakdown Voltage (Vac)

Dielectric Constant (1000 Hz)

Volume Resistivity (Ohm-meter)

Flame Rating

THERMAL

Thermal Conductivity (W/m-K)

THERMAL PERFORMANCE vs PRESSURE

1) The ASTM D5470 test fixture was used.The recorded value includes interfacial thermal resistance.These values are provided for

reference only. Actual application performance is directly related to the surface roughness, flatness and pressure applied.

SP900S

: U.S. Patents 4,574,879; 4,602,125; 4,602,678; 4,685,987; 4,842,911 and others

TO-220 Thermal Performance (°C/W)

–

Thermal Impedance (°C-in

0.009

TYPICAL PROPERTIES OF SIL-PAD 900S

Type 3 Electrodes

–

Pressure (psi)

ACME 951753 Rev B

/W) (1)

IMPERIAL VALUE

-76 to 356

Fiberglass

0.009

1300

5500

8300

Pink

V-O

6.0

1.6

3.96

0.95

Standard Options

NA = Selected standard option. If not selecting a standard

option, insert company name, drawing number, and

revision level.

_ _ _ = Standard configuration dash number,

1212 = 12" x 12" sheets, 12/250 = 12" x 250' rolls, or

00 = custom configuration

AC = Adhesive, one side

00 = No adhesive

Standard thicknesses available: 0.009"

SP900S = Sil-Pad 900S Material

METRIC VALUE

3.41

0.75

-60 to 180

Fiberglass

0.229

5500

8300

Pink

V-O

6.0

1.6

2.90

0.61

TEST METHOD

2.53

0.47

100

ASTM D2240

ASTM D5470

ASTM D374

ASTM D412

ASTM D149

ASTM D150

ASTM D257

U.L. 94

Visual

—

2.32

0.41

200

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