85401AKLFT IDT, Integrated Device Technology Inc, 85401AKLFT Datasheet - Page 9

• Manufacturer Part Number: 85401AKLFT
• Manufacturer: IDT, Integrated Device Technology Inc
• Type: Clock Multiplexerr

Specifications of 85401AKLFT

• Number Of Clock Inputs: 2
• Mode Of Operation: Differential
• Output Frequency: >2500MHz
• Output Logic Level: LVDS
• Operating Supply Voltage (min): 3.135V
• Operating Supply Voltage (typ): 3.3V
• Operating Supply Voltage (max): 3.465V
• Package Type: VFQFN
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 16
• Lead Free Status / RoHS Status: Compliant

Thermal Release Path
The expose metal pad provides heat transfer from the device to the
P.C. board. The expose metal pad is ground pad connected to
ground plane through thermal via. The exposed pad on the device
to the exposed metal pad on the PCB is contacted through solder
Figure 4. P.C. Board for Exposed Pad Thermal Release Path Example
3.3V LVDS Driver Termination
A general LVDS interface is shown in Figure 5 In a 100Ω differential
transmission line environment, LVDS drivers require a matched
load termination of 100Ω across near the receiver input. For a
Figure 5. Tyical LVDS Driver Termination
IDT™ / ICS™ LVDS MULTIPLEXER
ICS85401
2:1 DIFFERENTIAL-TO-LVDS MULTIPLEXER
3.3V
LVDS Driver
100Ω Differential Transmission Line
SOLDER MASK
SIGNAL
TRACE
GROUND PLANE
50Ω
50Ω
R1
100Ω
THERMAL VIA
9
as shown in Figure 4. For further information, please refer to the
Application Note on Surface Mount Assembly of Amkor’s
Thermally /Electrically Enhance Leadframe Base Package, Amkor
Technology.
multiple LVDS outputs buffer, if only partial outputs are used, it is
recommended to terminate the unused outputs.
EXPOSED PAD
+
–
3.3V
Expose Metal Pad
(GROUND PAD)
SOLDER
ICS85401AK REV. A MARCH 6, 2007
SIGNAL
TRACE