ICS8536AGI-33T IDT, Integrated Device Technology Inc, ICS8536AGI-33T Datasheet - Page 11

• Manufacturer Part Number: ICS8536AGI-33T
• Manufacturer: IDT, Integrated Device Technology Inc
• Type: Clock Driverr

Specifications of ICS8536AGI-33T

• Number Of Clock Inputs: 2
• Mode Of Operation: Single-Ended
• Output Frequency: 266MHz
• Operating Supply Voltage (min): 2.375V
• Operating Supply Voltage (typ): 2.5/3.3V
• Operating Supply Voltage (max): 3.465V
• Package Type: TSSOP
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 20
• Lead Free Status / RoHS Status: Supplier Unconfirmed

This section provides information on power dissipation and junction temperature for the ICS8536I-33.
Equations and example calculations are also provided.
1. Power Dissipation.
The total power dissipation for the ICS8536I-33 is the sum of the core power plus the power dissipated in the load(s).
The following is the power dissipation for V
NOTE: Please refer to Section 3 for details on calculating power dissipated in the load.
2. Junction Temperature.
Junction temperature, Tj, is the temperature at the junction of the bond wire and bond pad and directly affects the reliability of the
device. The maximum recommended junction temperature for HiPerClockS
In order to calculate junction temperature, the appropriate junction-to-ambient thermal resistance
moderate air flow of 200 linear feet per minute and a multi-layer board, the appropriate value is 66.6°C/W per Table 7 below.
Therefore, Tj for an ambient temperature of 85°C with all outputs switching is:
This calculation is only an example. Tj will obviously vary depending on the number of loaded outputs, supply voltage, air flow,
and the type of board (single layer or multi-layer).
T
8536AGI-33
ABLE
Single-Layer PCB, JEDEC Standard Test Boards
Multi-Layer PCB, JEDEC Standard Test Boards
NOTE: Most modern PCB designs use multi-layered boards. The data in the second row pertains to most designs.
7. T
Power (core)
Power (outputs)
If all outputs are loaded, the total power is 3 * 30mW = 90mW
Total Power
The equation for Tj is as follows: Tj =
Tj = Junction Temperature
Pd_total = Total Device Power Dissipation (example calculation is in section 1 above)
T
85°C + 0.516W * 66.6°C/W = 119.4°C. This is below the limit of 125°C.
JA
A
HERMAL
= Ambient Temperature
= Junction-to-Ambient Thermal Resistance
Integrated
Circuit
Systems, Inc.
R
ESISTANCE
MAX
_MAX
MAX
= V
(3.465V, with all outputs switching) = 426.2mW + 90mW = 516.2mW
= 30mW/Loaded Output pair
CC_MAX
JA
FOR
* I
EE_MAX
20-
JA
P
CC
PIN
by Velocity (Linear Feet per Minute)
www.icst.com/products/hiperclocks.html
= 3.465V * 123mA =426.2mW
PRELIMINARY
= 3.3V + 5% = 3.465V, which gives worst case results.
LVCMOS-
OWER
TSSOP, F
JA
* Pd_total + T
C
ORCED
ONSIDERATIONS
TO
A
11
C
114.5°C/W
-3.3V LVPECL/LVCMOS F
ONVECTION
73.2°C/W
L
0
OW
TM
S
devices is 125°C.
KEW
, 1-
98.0°C/W
66.6°C/W
200
TO
-6, C
JA
must be used. Assuming a
ICS8536I-33
RYSTAL
88.0°C/W
63.5°C/W
500
ANOUT
O
REV. A MARCH 16, 2006
SCILLATOR
B
UFFER
/