LMH6582YA National Semiconductor, LMH6582YA Datasheet - Page 4

• Manufacturer Part Number: LMH6582YA
• Manufacturer: National Semiconductor

Specifications of LMH6582YA

• Array Configuration: 16x8
• Number Of Arrays: 1
• Screening Level: Industrial
• Pin Count: 64
• Package Type: TQFP EP
• Power Supply Requirement: Dual
• Lead Free Status / RoHS Status: Not Compliant

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TCV
I
TCI
V
V
PSRR
I
I
XTLK
ISOL
Miscellaneous Performance
R
C
R
R
CMVR
I
Digital Control
V
V
V
V
T
T
B
CC
EE
O
S
H
O
O
IH
IL
OH
OL
Symbol
IN
IN
O
O
Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is
intended to be functional, but specific performance is not guaranteed. For guaranteed specifications, see the Electrical Characteristics tables.
Note 2: Human Body Model, applicable std. MIL-STD-883, Method 3015.7. Machine Model, applicable std. JESD22-A115-A (ESD MM std. of JEDEC)
Field-Induced Charge-Device Model, applicable std. JESD22-C101-C (ESD FICDM std. of JEDEC).
Note 3: The maximum output current (I
Note 4: The maximum power dissipation is a function of T
P
Note 5: Electrical Table values apply only for factory testing conditions at the temperature indicated. No guarantee of parametric performance is indicated in the
electrical tables under conditions different than those tested.
Note 6: Slew Rate is the average of the rising and falling edges.
Note 7: Typical values represent the most likely parametric norm as determined at the time of characterization. Actual typical values may vary over time and will
also depend on the application and configuration. The typical values are not tested and are not guaranteed on shipped production material.
Note 8: Room Temperature limits are 100% production tested at 25°C. Factory testing conditions result in very limited self-heating of the device such that T
T
Note 9: Negative input current implies current flowing out of the device.
Note 10: Drift determined by dividing the change in parameter at temperature extremes by the total temperature change.
Note 11: This parameter is guaranteed by design and/or characterization and is not tested in production.
Ordering Information
64-Pin QFP
A
D
B
Package
. Limits over the operating temperature range are guaranteed through correlation using Statistical Quality Control (SQC) methods.
OS
= (T
J(MAX)
Output Offset Voltage Average
Drift
Input Bias Current
Input Bias Current Average Drift
Output Voltage Range
Output Voltage Range
Power Supply Rejection Ratio
Positive Supply Current
Negative Supply Current
Tri State Supply Current
DC Crosstalk
DC Off Isloation
Input Resistance
Input Capacitance
Output Resistance
Output Resistance
Input Common Mode Voltage
Range
Output Current
– T
A
)/ θ
JA
. All numbers apply for packages soldered directly onto a PC Board.
Parameter
Part Number
LMH6582YA
OUT
) is determined by device power dissipation limitations.
(Note 10)
Non-Inverting (Note 9)
Non-Inverting (Note 10)
R
R
R
R
R
RST pin > 2.0V
DC, Channel to Channel
DC
Non-Inverting
Non-Inverting
Closed Loop, Enabled
Disabled
Sourcing, V
Input Voltage High
Input Voltage Low
Output Voltage High
Output Voltage Low
Setup Time
Hold Time
J(MAX)
L
L
L
L
L
= 100Ω
=
=
=
=
∞
∞
∞
∞
, θ
Package Marking
JA
. The maximum allowable power dissipation at any ambient temperature is
LMH6582YA
O
Conditions
= 0 V
4
(Note 8)
±2.93
±2.9
Min
Transport Media
−58
−60
±60
2.0
42
160 Units/Tray
(Note 7)
±3.1
±3.2
±3.1
>2.4
<0.4
Typ
−12
−90
−90
±70
110
104
100
300
−5
38
45
20
70
1
5
5
(Note 8)
Max
−12
125
120
0.8
30
NSC Drawing
VXE64A
µV/°C
nA/°C
Units
dBc
dBc
mΩ
mA
mA
mA
mA
µA
dB
kΩ
pF
kΩ
ns
ns
V
V
V
V
V
V
V
J
=