AD8019ARUZ-REEL Analog Devices Inc, AD8019ARUZ-REEL Datasheet - Page 12
![](/photos/31/30/313036/505-14-tssop_sml.jpg)
AD8019ARUZ-REEL
Manufacturer Part Number
AD8019ARUZ-REEL
Description
Manufacturer
Analog Devices Inc
Datasheet
1.AD8019ARUZ-REEL.pdf
(20 pages)
Specifications of AD8019ARUZ-REEL
Power Supply Requirement
Single/Dual
Package Type
TSSOP
Slew Rate
450V/us
Pin Count
14
Lead Free Status / RoHS Status
Compliant
AD8019
Table II. Junction Temperature vs. Line Power and Operating
Voltage for SOIC
P
13
14
15
16
17
18
Thermal stitching, which connects the outer layers to the inter-
nal ground plane(s), can help to utilize the thermal mass of the
PCB to draw heat away from the line driver and other active
components.
LAYOUT CONSIDERATIONS
As is the case with all high-speed applications, careful attention
to printed circuit board layout details will prevent associated
board parasitics from becoming problematic. Proper RF design
technique is mandatory. The PCB should have a ground plane
covering all unused portions of the component side of the board
to provide a low-impedance return path. Removing the ground
plane on all layers from the areas near the input and output pins
will reduce stray capacitance, particularly in the area of the
inverting inputs. The signal routing should be short and direct
in order to minimize parasitic inductance and capacitance asso-
ciated with these traces. Termination resistors and loads should
be located as close as possible to their respective inputs and
outputs. Input and output traces should be kept as far apart as
possible to minimize coupling (crosstalk) though the board.
Wherever there are complementary signals, a symmetrical
layout should be provided to the extent possible to maximize
balanced performance. When running differential signals over a
long distance, the traces on the PCB should be close together or
any differential wiring should be twisted together to minimize
the area of the loop that is formed. This will reduce the radiated
LINE
Table III. Junction Temperature vs. Line Power and
Operating Voltage for TSSOP
Table IV. Junction Temperature vs. Line Power and
Operating Voltage for SOIC
, dBm
P
13
14
15
16
P
13
14
15
16
LINE
LINE
137
140
142
145
147
150
, dBm
, dBm
12
+12
115
116
118
120
+12
118
120
122
124
V
V
SUPPLY
SUPPLY
V
SUPPLY
140
142
145
148
150
153
12.5
+13
118
119
121
123
+13
121
123
125
128
143
145
148
151
154
157
13
energy and make the circuit less susceptible to RF interference.
Adherence to stripline design techniques for long signal traces
(greater than about 1 inch) is recommended.
Evaluation Board
The AD8019 is available installed on an evaluation board for
both package styles. Figures 8 and 9 show the schematics for the
TSSOP evaluation board.
The receiver circuit on these boards is typically unpopulated.
Requesting samples of the AD8022AR, along with either of the
AD8019 evaluation boards, will provide the capability to evaluate
the AD8019 along with other Analog Devices products in a typical
transceiver circuit. The evaluation circuits have been designed
to replicate the CPE side analog transceiver hybrid circuits.
The circuit mentioned above is designed using a 1-transformer
transceiver topology including a line receiver, line driver, line
matching network, an RJ11 jack for interfacing to line simula-
tors, and differential inputs.
AC-coupling capacitors of 0.1 F, C8, and C10, in combination
with 10 k , resistors R24 and R25, will form a 1st order high-
pass pole at 160 Hz.
Transformer Selection
Customer premise ADSL requires the transmission of a 13 dBm
(20 mW) DMT signal. The DMT signal has a crest factor of 5.3,
requiring the line driver to provide peak line power of 560 mW.
560 mW peak line power translates into a 7.5 V peak voltage on
a 100
tion output swing available from the AD8019 line driver on a
to the termination resistance, a step-up transformer with turns
ratio of 1:1 is adequate for most applications. If the modem
designer desires to transmit more than 13 dBm down the twisted
pair, a higher turns ratio can be used for the transformer. This
trade-off comes at the expense of higher power dissipation by
the line driver as well as increased attenuation of the downstream
signal that is received by the transceiver.
In the simplified differential drive circuit shown in Figure 7,
the AD8019 is coupled to the phone line through a step-up
transformer with a 1:1 turns ratio. R1 and R2 are back termi-
nation or line matching resistors, each 50
where 100
transformer reflects impedance from the line side to the IC
side as a value inversely proportional to the square of the turns
ratio. The total differential load for the AD8019, including the
termination resistors, is 200 . Even under these conditions
the AD8019 provides low distortion signals to within 2 V of
the power supply rails.
One must take care to minimize any capacitance present at the
outputs of a line driver. The sources of such capacitance can
include, but are not limited to EMI suppression capacitors,
overvoltage protection devices and the transformers used in the
hybrid. Transformers have two kinds of parasitic capacitances,
distributed, or bulk capacitance, and interwinding capacitance.
Distributed capacitance is a result of the capacitance created
between each adjacent winding on a transformer. Interwinding
capacitance is the capacitance that exists between the windings
on the primary and secondary sides of the transformer. The
existence of these capacitances is unavoidable, but in specifying
12 V supply is 20 V and taking into account the power lost due
telephone line. Assuming that the maximum low distor-
is the approximate phone line impedance. A
(100 /(2
1
2
))