"TJA1050T/V,112" NXP Semiconductors, "TJA1050T/V,112" Datasheet - Page 13

• Manufacturer Part Number: "TJA1050T/V,112"
• Manufacturer: NXP Semiconductors

Specifications of "TJA1050T/V,112"

• Number Of Transceivers: 1
• Power Down Mode: Standby
• Standard Supported: ISO 11898
• Operating Supply Voltage (max): 5.25V
• Operating Supply Voltage (typ): 5V
• Operating Supply Voltage (min): 4.75V
• Package Type: SO
• Supply Current: 10mA
• Operating Temperature (max): 150C
• Operating Temperature (min): -40C
• Operating Temperature Classification: Automotive
• Mounting: Surface Mount
• Pin Count: 8
• Lead Free Status / RoHS Status: Compliant

Philips Semiconductors
BONDING PAD LOCATIONS
Note
1. All x/y coordinates represent the position of the centre
2003 Oct 22
TXD
GND
V
RXD
V
CANL
CANH
S
CC
ref
High speed CAN transceiver
SYMBOL
of each pad (in m) with respect to the lefthand bottom
corner of the top aluminium layer (see Fig.13).
PAD
1
2
3
4
5
6
7
8
1371.5
886.5
538.5
1394
103
740
998
103
COORDINATES
x
1094
1115
1115
1097
103
111
111
(1)
85
y
13
handbook, halfpage
The backside of the bare die must be connected to ground.
x
Fig.13 Bonding pad locations.
0
0
y
8
1
TJA1050U
7
2 3
6
Product specification
MGS381
5
4
TJA1050
test pad