TJA1040T/N,118 NXP Semiconductors, TJA1040T/N,118 Datasheet - Page 11

TJA1040T/N,118

Manufacturer Part Number
TJA1040T/N,118
Description
Manufacturer
NXP Semiconductors
Datasheet

Specifications of TJA1040T/N,118

Number Of Transceivers
1
Power Down Mode
Standby
Standard Supported
ISO 11898
Operating Supply Voltage (max)
5.25V
Operating Supply Voltage (typ)
5V
Operating Supply Voltage (min)
4.75V
Package Type
SO
Supply Current
70mA
Operating Temperature (max)
150C
Operating Temperature (min)
-40C
Operating Temperature Classification
Automotive
Mounting
Surface Mount
Pin Count
8
Lead Free Status / RoHS Status
Not Compliant
Philips Semiconductors
BONDING PAD LOCATIONS
Note
1. All x/y coordinates represent the position of the centre
2003 Oct 14
TXD
GND
V
RXD
SPLIT
CANL
CANH
STB
CC
High speed CAN transceiver
SYMBOL
of each pad (in m) with respect to the left hand
bottom corner of the top aluminium layer (see Fig.9).
PAD
1
2
3
4
5
6
7
8
1214.25
1635.25
1516.5
530.25
113.75
119.5
648.5
990.5
COORDINATES
x
1273.75
1273.75
114.5
114.5
114.5
1275
1246
(1)
85
y
11
handbook, halfpage
The backside of the bare die must be connected to ground.
x
0
0
y
Fig.9 Bonding pad locations.
8
1
TJA1040U
7
2
6
3
Product specification
5
4
TJA1040
test pad 1
test pad 2
MBL584

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