GD82541PI Intel, GD82541PI Datasheet - Page 35

• Manufacturer Part Number: GD82541PI
• Manufacturer: Intel

Specifications of GD82541PI

• Operating Temperature Classification: Commercial
• Mounting: Surface Mount
• Pin Count: 196
• Lead Free Status / RoHS Status: Not Compliant

5.2
Table 13. Thermal Characteristics
Thermal Specifications
The 82541(PI/GI/EI) device is specified for operation when the ambient temperature (T
the range of 0
T
TJ (junction temperature) is calculated using the equation:
P (power consumption) is calculated by using the typical I
and nominal V
Thermal resistances are determined empirically with test devices mounted on standard thermal test
boards. Real system designs may have different characteristics due to board thickness, arrangement
of ground planes, and proximity of other components. The case temperature measurements should
be used to assure that the 82541(PI/GI/EI) device is operating under recommended conditions.
θ
θ
Symbol
C
JA
JC
(case temperature) is calculated using the equation:
T
T
C
J
= T
= T
A
Thermal resistance, junction-to-ambient
Thermal resistance, junction-to-case
A
+ P θ
+ P (θ
°
CC
C to 70
. The preliminary thermal resistances are shown in
JA
JA
°
- θ
C.
JC
Parameter
)
Networking Silicon — 82541(PI/GI/EI)
Preliminary Value at specified
CC
11.1
29
0
, as indicated in
airflow (m/s)
Table
25.0
11.1
1
13.
Table 7 of Section
23.5
11.1
2
A
) is within
C/Watt
C/Watt
Units
4.0,
35