WG82574IT S LBAB Intel, WG82574IT S LBAB Datasheet - Page 459
WG82574IT S LBAB
Manufacturer Part Number
WG82574IT S LBAB
Description
Manufacturer
Intel
Datasheet
1.WG82574IT_S_LBAB.pdf
(472 pages)
Specifications of WG82574IT S LBAB
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
64
Lead Free Status / RoHS Status
Compliant
- Current page: 459 of 472
- Download datasheet (3Mb)
Thermal Design Considerations—82574 GbE Controller
14.14
Note:
PCB Guidelines
The following general PCB design guidelines are recommended to maximize the thermal
performance of QFN packages:
The previously mentioned guidelines are not all inclusive and are defined to give
known, good design practices to maximize the thermal performance of the
components.
1. When connecting ground (thermal) vias-to the ground planes, do not use thermal-
2. Thermal-relief patterns are designed to limit heat transfer between the vias and the
3. As board temperature also has an effect on the thermal performance of the
4. If airflow exists, locate the components in the mainstream of the airflow path for
relief patterns.
copper planes, thus constricting the heat flow path from the component to the
ground planes in the PCB.
package, avoid placing 82574 adjacent to high power dissipation devices.
maximum thermal performance. Avoid placing the components downstream,
behind larger devices or devices with heat sinks that obstruct the air flow or supply
excessively heated air.
459
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