BLM21PG331SN1D Murata Electronics North America, BLM21PG331SN1D Datasheet - Page 4
![FERRITE BEAD 330OHM 0805](/photos/6/6/60605/blm21_series_0805_sml.jpg)
BLM21PG331SN1D
Manufacturer Part Number
BLM21PG331SN1D
Description
FERRITE BEAD 330OHM 0805
Manufacturer
Murata Electronics North America
Series
EMIFIL®, BLM21Pr
Specifications of BLM21PG331SN1D
Impedance @ Frequency
330 Ohm @ 100MHz
Current Rating
1.5A
Dc Resistance (dcr)
90.00 mOhm Max
Filter Type
Differential Mode - Single
Number Of Lines
1
Package / Case
0805 (2012 Metric)
Mounting Type
Surface Mount
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
Q3992694
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
BLM21PG331SN1D
Manufacturer:
MURATA
Quantity:
240 000
Company:
Part Number:
BLM21PG331SN1D
Manufacturer:
MURATA
Quantity:
5 437
Part Number:
BLM21PG331SN1D
Manufacturer:
MURATA/村田
Quantity:
20 000
I !Caution/Notice
! Note:
1. This datasheet is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our
2. This datasheet has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product
o
!Caution (Rating)
products in it may be discontinued without advance notice. Please check with our sales representatives or product engineers before ordering.
specifications or transact the approval sheet for product specifications before ordering.
Continued from the preceding page.
This data sheet is applied for CHIP FERRITE BEAD used for General Electronics equipment for your design.
Do not use products beyond the rated current as
this may create excessive heat and deteriorate
the insulation resistance.
Noise Suppression Products/EMI Suppression Filters > EMIFILr (Inductor type) > Chip Ferrite Bead
http://www.murata.com/
Data Sheet
Notice
Solderability of Tin plating termination chip might be
deteriorated when low temperature soldering profile
where peak solder temperature is below the Tin melting
point is used. Please confirm the solderability of Tin
plating termination chip before use.
2011.3.3
4