Thermal Characteristics
Electrical Characteristics
Maximum Ratings
Features
•
•
•
•
•
Collector-Base Voltage
Collector-Emitter Voltage
Emitter-Base Voltage
Collector Current
Power Dissipation (Note 2)
Thermal Resistance, Junction to Ambient (Note 2)
Operating and Storage Temperature Range
Collector-Base Breakdown Voltage
Collector-Emitter Breakdown Voltage
Emitter-Base Breakdown Voltage
DC Current Gain
Collector-Emitter Saturation Voltage
Base-Emitter Saturation Voltage
Base-Emitter Voltage
Collector-Emitter Cutoff Current
Gain Bandwidth Product
Output Capacitance
Noise Figure
Notes:
BC847BVC
Document number: DS30638 Rev. 5 - 2
Epitaxial Die Construction
Ultra-Small Surface Mount Package
Lead Free By Design/RoHS Compliant (Note 3)
"Green" Device (Note 4)
Qualified to AEC-Q101 Standards for High Reliability
1. Package is non-polarized. Parts may be on reel in orientation illustrated, 180° rotated, or mixed (both ways).
2. Device mounted on FR-4 PCB, 1 inch x 0.85 inch x 0.062 inch; pad layout as shown on Diodes Inc. suggested pad layout document AP02001, which
3. No purposefully added lead.
4. Diodes Inc's "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php
5. Short duration pulse test used to minimize self-heating effect.
can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf.
Characteristic
Characteristic
Characteristic
@T
Top View
A
= 25°C unless otherwise specified
@T
(Note 5)
(Note 5)
(Note 5)
(Note 5)
(Note 5)
(Note 5)
(Note 5)
(Note 5)
A
= 25°C unless otherwise specified
Bottom View
V
V
V
V
Symbol
V
(BR)CBO
(BR)CEO
(BR)EBO
CE(SAT)
BE(SAT)
C
I
I
V
h
CBO
CBO
NF
OBO
f
FE
BE
T
www.diodes.com
NPN DUAL SMALL SIGNAL SURFACE MOUNT TRANSISTOR
1 of 4
Min
200
580
100
50
45
—
—
—
—
—
—
6
Mechanical Data
•
•
•
•
•
•
•
•
T
Symbol
Symbol
J
V
V
Please click here to visit our online spice models database.
V
R
, T
P
Case: SOT-563
Case Material: Molded Plastic, "Green" Molding Compound. UL
Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020D
Terminal Connections: See Diagram
Terminals: Finish - Matte Tin annealed over Copper leadframe.
Solderable per MIL-STD-202, Method 208
Marking Information: See Page 2
Ordering Information: See Page 2
Weight: 0.002 grams (approximate)
CBO
CEO
EBO
I
θ JA
C
Device Schematic
D
E
Typ
290
700
900
660
C
STG
—
—
—
—
—
—
—
—
—
1
1
B
B
2
1
Max
450
100
300
700
770
5.0
4.5
—
—
—
—
15
—
10
E
C
2
2
-55 to +150
Value
Value
MHz
Unit
mV
mV
mV
100
150
833
nA
µA
dB
pF
6.0
—
50
45
V
V
V
I
I
I
V
I
I
I
I
V
V
V
V
V
f = 100MHz
V
V
f = 1.0kHz, BW = 200Hz
C
C
E
C
C
C
C
CE
CE
CE
CB
CB
CE
CB
CE
= 1μA, I
= 10μA, I
= 10mA, I
= 10mA, I
= 100mA, I
= 10mA, I
= 100mA, I
= 5.0V, I
= 5.0V, I
= 5.0V, I
= 30V
= 30V, T
= 5.0V, I
= 10V, f = 1.0MHz
= 5V, R
Test Condition
C
B
B
= 0
B
B
S
BC847BVC
C
C
C
A
C
= 0
B
B
= 0
= 0.5mA
= 0.5mA
= 2.0kΩ,
= 2.0mA
= 2.0mA
= 10mA
= 150°C
= 10mA,
= 5.0mA
= 5.0mA
© Diodes Incorporated
°C/W
Unit
Unit
mW
mA
°C
V
V
V
April 2009