MCP9502PT-065E/OT Microchip Technology, MCP9502PT-065E/OT Datasheet - Page 9

• Manufacturer Part Number: MCP9502PT-065E/OT
• Description: Factory Programmed Temperature Switch, Active High, Push-pull Output 5 SOT-23 T
• Manufacturer: Microchip Technology

Specifications of MCP9502PT-065E/OT

• Leaded Process Compatible: Yes
• Rohs Compliant: Yes
• Sensing Accuracy Range: ± 2°C
• Temperature Sensing Range: -40°C To +125°C
• Supply Current: 25µA
• Supply Voltage Range: 2.7V To 5.5V
• Sensor Case Style: SOT-23
• No. Of Pins: 5
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

4.1
The
integrates a temperature sensor and a comparator
circuit which outputs an alert signal when the factory
set temperature threshold is exceeded. No additional
component is required for device operation, which
provides simplicity to the system designer. The device
output options provide design flexibility for various
applications such as overtemperature protection circuit
or a closed loop temperature control unit. This device
can be interfaced to a closed loop fan controller
network without the need for a microcontroller.
FIGURE 4-3:
MCP9502.
The MCP9501/2/3/4 provide Open-Drain output where
multiple sensors from multiple PCB hot-spots can be
connected to a single processor I/O input with a wired-
OR configuration. The MCP9501 requires an external
pull-up resistor which can be used to level-shift the alert
signal. For example, if the sensors are powered with
5V
3V
connecting 3V
Figure
FIGURE 4-4:
Configuration with Level-shift.
© 2011 Microchip Technology Inc.
DD
DD
HYST
HYST
, the external resistor can be level-shifted by
and the controller or processor is powered with
MCP9501/2/3/4
4-4.
Application Information
HYST
MCP9503
MCP9501
5V
5V
35°C
85°C
DD
DD
DD
MCP9502
5V
to the pull-up resistor as shown in
DD
Fan Controller Using
MCP9501 Wired-OR Output
OUT
OUT
temperature
Output
I/O
3V
switch
12V
M
controller
DD
Micro-
family
4.1.1
This family of sensors measures temperature by
monitoring the voltage level of a thermal diode located
in the die. A low-impedance thermal path between the
die and the PCB is provided by the pins. Therefore, the
sensor effectively monitors PCB temperature. For
efficient performance, it is recommended to layout the
device as close to the heat source as possible.
When connecting an external resistor to the MCP9501/
3, the current through the pull-up resistor must be
considered to prevent self-heat due to power. This can
be determined using
EQUATION 4-1:
For example, at room temperature, when the output
asserts Active-Low and maximum I
V
specification table), the self heating due to power
dissipation (T
Where:
DD
= 5.5V, V
I
T
V
OUT
θ
J
T
OL
T
JA
–
A
J
LAYOUT CONSIDERATION AND
THERMAL CONSIDERATION
T
A
J
OL
- T
=
MCP9501/2/3/4
=
=
=
=
=
A
θ
= 0.3V and I
) is ~0.4°C.
JA
Equation
(
V
Junction Temperature
Ambient Temperature
Package Thermal Resistance
(220.7 °C/W)
Sensor Output Low Voltage
Output Current
EFFECT OF
SELF-HEATING
DD
×
I
DD
4-1.
OUT
+
V
OL
= 5 mA (see the
DS22268A-page 9
×
DD
I
OUT
= 50 µA,
)