PIC18F43K20-I/ML Microchip Technology, PIC18F43K20-I/ML Datasheet - Page 5
![8 KB Enh Flash, 768 RAM, 36 I/O, Nanowatt XLP 44 QFN 8x8x0.9mm TUBE](/photos/6/81/68122/150-44-qfn_sml.jpg)
PIC18F43K20-I/ML
Manufacturer Part Number
PIC18F43K20-I/ML
Description
8 KB Enh Flash, 768 RAM, 36 I/O, Nanowatt XLP 44 QFN 8x8x0.9mm TUBE
Manufacturer
Microchip Technology
Series
PIC® XLP™ 18Fr
Datasheets
1.PIC18F25K20T-ISS.pdf
(42 pages)
2.PIC18F25K20T-ISS.pdf
(456 pages)
3.PIC18F23K20-ISS.pdf
(10 pages)
Specifications of PIC18F43K20-I/ML
Core Processor
PIC
Core Size
8-Bit
Speed
64MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, HLVD, POR, PWM, WDT
Number Of I /o
35
Program Memory Size
8KB (4K x 16)
Program Memory Type
FLASH
Eeprom Size
256 x 8
Ram Size
512 x 8
Voltage - Supply (vcc/vdd)
1.8 V ~ 3.6 V
Data Converters
A/D 14x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
44-QFN
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
10. Module: Program Flash Memory
2010 Microchip Technology Inc.
The write/erase endurance of the Program Flash
Memory is limited to 1K cycles when V
3V. Endurance degrades when V
Work around
For data tables in Program Flash Memory use
error correction method that stores data in multiple
locations.
Affected Silicon Revisions
PIC18F23/43K20
A0
X
A1
X
DD
is below 3V.
DD
is above
11. Module: ADC
• The potential for failures increases over the
• The potential for failures is highest at low V
After extended stress the Most Significant bit
(MSb) of the ADC conversion result can become
stuck at ‘0’. Conversions resulting in code 511 or
less are still accurate, but conversions that
should result in codes greater than 511 are
instead pinned at 511.
The potential for failures is a function of several
factors:
Work around
Affected Silicon Revisions
PIC18F23/43K20
1. Restrict the input voltage to less than 1/2 of
2. Use manual acquisition time (ACQT<2:0> =
A0
life of the part. No failures have ever been
seen for accelerated stress estimated to be
equivalent to 34 years at room temperature.
The failure rate after accelerated stress esti-
mated to be equivalent to 146 years at room
temperature can be as high as 10% for V
1.8V. The time to failure will decrease as the
operating temperature increases.
and decreases as V
X
the ADC voltage reference so that the
expected result is always a code less than
or equal to 511.
000) and put the part to Sleep after each
conversion.
PIC18F23/43K20
A1
DD
increases.
DS80469C-page 5
DD
DD
=