PIC24FJ16GA002-E/SO Microchip Technology, PIC24FJ16GA002-E/SO Datasheet - Page 2
![no-image](/images/manufacturer_photos/0/4/439/microchip_technology_sml.jpg)
PIC24FJ16GA002-E/SO
Manufacturer Part Number
PIC24FJ16GA002-E/SO
Description
16-bit Family, 16 MIPS, 16KB Flash, 4096 Bytes RAM, 21 I/O, NanoWatt 28 SOIC .30
Manufacturer
Microchip Technology
Series
PIC® 24Fr
Datasheets
1.PIC24FJ16GA002-ISS.pdf
(52 pages)
2.PIC24FJ16GA002-ISS.pdf
(268 pages)
3.PIC24FJ16GA002-ISS.pdf
(22 pages)
Specifications of PIC24FJ16GA002-E/SO
Core Processor
PIC
Core Size
16-Bit
Speed
32MHz
Connectivity
I²C, PMP, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, LVD, POR, PWM, WDT
Number Of I /o
21
Program Memory Size
16KB (5.5K x 24)
Program Memory Type
FLASH
Ram Size
4K x 8
Voltage - Supply (vcc/vdd)
2 V ~ 3.6 V
Data Converters
A/D 10x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 125°C
Package / Case
28-SOIC (7.5mm Width)
Processor Series
PIC24FJ
Core
PIC
Data Bus Width
16 bit
Data Ram Size
4 KB
Interface Type
I2C, IrDA, SPI, UART
Maximum Clock Frequency
32 MHz
Number Of Programmable I/os
21
Number Of Timers
5
Maximum Operating Temperature
+ 125 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52713-733, 52714-737, 53276-922, EWDSPIC
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, DM240011, MA240013, AC164127, DM300027, DV164033, DM240002
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 10 Channel
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
DM240011 - KIT STARTER MPLAB FOR PIC24F MCUAC162088 - HEADER MPLAB ICD2 24FJ64GA004 28AC164339 - MODULE SKT FOR PM3 28SOICDV164033 - KIT START EXPLORER 16 MPLAB ICD2
Eeprom Size
-
Lead Free Status / Rohs Status
Details
PIC24FJ64GA004 FAMILY
TABLE 2:
DS80470E-page 2
JTAG
LVD
Core
Core
Core
Core
A/D
A/D
A/D
I
UART
UART
UART
UART
UART
UART
Output
Compare
SPI
SPI
SPI
I/O
I/O
JTAG
RTCC
I
I
UART
I/O
UART
Note 1:
2
2
2
C
C
C
Module
Only those issues indicated in the last column apply to the current silicon revision.
Idle mode
Doze mode
BOR
RAM
SDA Line
State (I2C1)
Auto-Baud
Auto-Baud
Auto-Baud
Break
Character
Generation
Enhanced
Buffer mode
Enhanced
Buffer mode
Slave mode
IrDA
PPS
UERIF
Interrupt
SILICON ISSUE SUMMARY
Feature
®
—
—
—
—
—
—
—
—
—
—
—
—
—
—
Number
Item
10.
12.
13.
14.
15.
16.
17.
18.
19.
20.
21.
22.
23.
24.
25.
26.
27.
28.
29.
11.
1.
2.
3.
4.
5.
6.
7.
8.
9.
Persistent pull-up (RA3) when JTAG
disabled.
No LVD interrupt with low-voltage condition
at Reset.
Clock failure trap fails in Idle mode.
RAM read repeat on entering Doze mode.
POR and BOR flags both set on BOR.
RAM size implementation on some devices.
Unimplemented channels may be selected.
Missing midscale conversion code.
Device may not wake when convert on INT0
trigger is selected.
Line state may not be detected correctly.
Reception failures in High-Speed mode.
Erroneous baud rate calculations in
High-Speed mode.
Double receive interrupt with auto-baud
reception.
Insertion of spurious data with auto-baud
reception.
Auto-baud calculation errors causing
transmit or receive failures.
The UART module will not generate
back-to-back Break characters.
Single missed compare events under certain
conditions.
Some flag bits are set at incorrect times in
Enhanced Buffer mode.
Module in Slave mode may ignore SS pin
and receive data anyway.
No SPI interrupt in Enhanced Buffer mode
under certain conditions.
Spec change for V
OSCO/RA3 driven immediately following
POR.
Sync loss in ICSP™ mode.
Write errors to ALCFGRPT register.
In Slave mode, ACKSTAT bit state change.
Issues with write operations on I2CxSTAT.
IR baud clock only available during transmit.
Issues with digital signal priorities with RP12
and RP18.
No UERIF flag with multiple errors.
Issue Summary
OL
and V
OH
.
A3/A4
2010 Microchip Technology Inc.
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
Affected Revisions
B4
X
X
B5
X
X
(1)
B8
X
X