PIC24FJ48GA004-E/ML Microchip Technology, PIC24FJ48GA004-E/ML Datasheet - Page 231
![16-bit Family, 16 MIPS, 48KB Flash, 8192 Bytes RAM, 35 I/O, NanoWatt 44 QFN 8x8x](/photos/6/81/68122/150-44-qfn_sml.jpg)
PIC24FJ48GA004-E/ML
Manufacturer Part Number
PIC24FJ48GA004-E/ML
Description
16-bit Family, 16 MIPS, 48KB Flash, 8192 Bytes RAM, 35 I/O, NanoWatt 44 QFN 8x8x
Manufacturer
Microchip Technology
Series
PIC® 24Fr
Datasheets
1.PIC24FJ16GA002-ISS.pdf
(52 pages)
2.PIC24FJ16GA002-ISS.pdf
(268 pages)
3.PIC24FJ16GA002-ISS.pdf
(22 pages)
Specifications of PIC24FJ48GA004-E/ML
Core Processor
PIC
Core Size
16-Bit
Speed
32MHz
Connectivity
I²C, PMP, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, LVD, POR, PWM, WDT
Number Of I /o
35
Program Memory Size
48KB (16K x 24)
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
2 V ~ 3.6 V
Data Converters
A/D 13x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 125°C
Package / Case
44-QFN
Processor Series
PIC24FJ
Core
PIC
Data Bus Width
16 bit
Data Ram Size
8 KB
Interface Type
I2C, IrDA, SPI, UART
Maximum Clock Frequency
32 MHz
Number Of Programmable I/os
35
Number Of Timers
5
Maximum Operating Temperature
+ 125 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52713-733, 52714-737, 53276-922, EWDSPIC
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, DM240011, DV164033, MA240013, AC164127, DM240002
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 13 Channel
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
876-1004 - PIC24 BREAKOUT BOARDDM240011 - KIT STARTER MPLAB FOR PIC24F MCUAC162088 - HEADER MPLAB ICD2 24FJ64GA004 28AC164336 - MODULE SOCKET FOR PM3 28/44QFNDV164033 - KIT START EXPLORER 16 MPLAB ICD2
Eeprom Size
-
Lead Free Status / Rohs Status
Details
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
PIC24FJ48GA004-E/ML
Manufacturer:
Microchip Technology
Quantity:
135
- PIC24FJ16GA002-ISS PDF datasheet
- PIC24FJ16GA002-ISS PDF datasheet #2
- PIC24FJ16GA002-ISS PDF datasheet #3
- Current page: 231 of 268
- Download datasheet (2Mb)
TABLE 27-1:
TABLE 27-2:
2010 Microchip Technology Inc.
PIC24FJ64GA004 Family:
Power Dissipation:
Maximum Allowed Power Dissipation
Package Thermal Resistance, 300 mil SOIC
Package Thermal Resistance, 6x6x0.9 mm QFN
Package Thermal Resistance, 8x8x1 mm QFN
Package Thermal Resistance, 10x10x1 mm TQFP
Note 1:
Operating Junction Temperature Range
Operating Ambient Temperature Range
Internal Chip Power Dissipation:
I/O Pin Power Dissipation:
P
P
INT
I
/
O
Junction to ambient thermal resistance, Theta-
= ({V
= V
DD
THERMAL OPERATING CONDITIONS
THERMAL PACKAGING CHARACTERISTICS
x (I
DD
DD
– V
Characteristic
OH
– I
} x I
Rating
OH
OH
)
) + (V
OL
x I
OL
PIC24FJ64GA004 FAMILY
)
JA
(
JA
) numbers are achieved by package simulations.
Symbol
Symbol
P
DMAX
P
T
T
JA
JA
JA
JA
A
D
J
33.7
39.3
Min
Typ
-40
-40
49
28
(T
P
J
INT
– T
Max
Typ
—
—
—
—
—
—
+ P
A
)/
I
/
O
JA
DS39881D-page 231
+140
+125
°C/W
°C/W
°C/W
°C/W
Max
Unit
(Note 1)
(Note 1)
(Note 1)
(Note 1)
Notes
Unit
°C
°C
W
W
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