SST39VF512-70-4I-NHE Microchip Technology, SST39VF512-70-4I-NHE Datasheet - Page 21

• Manufacturer Part Number: SST39VF512-70-4I-NHE
• Description: 2.7V To 3.6V 512Kbit Multi-Purpose Flash 32 PLCC TUBE
• Manufacturer: Microchip Technology

Specifications of SST39VF512-70-4I-NHE

• Format - Memory: FLASH
• Memory Type: FLASH
• Memory Size: 512K (64K x 8)
• Speed: 70ns
• Interface: Parallel
• Voltage - Supply: 2.7 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C
• Package / Case: *
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

512 Kbit / 1 Mbit / 2 Mbit / 4 Mbit Multi-Purpose Flash
SST39LF512 / SST39LF010 / SST39LF020 / SST39LF040
SST39VF512 / SST39VF010 / SST39VF020 / SST39VF040
PACKAGING DIAGRAMS
©2010 Silicon Storage Technology, Inc.
FIGURE 21: 32-lead Plastic Lead Chip Carrier (PLCC)
FIGURE 22: 48-ball Thin-profile, Fine-pitch Ball Grid Array (TFBGA) 6mm x 8mm
Note:
Note: 1. Complies with JEDEC publication 95 MS-016 AE dimensions, although some dimensions may be more stringent.
Identifier
Optional
Pin #1
.595
.585
6
5
4
3
2
1
A1 CORNER
1. Complies with JEDEC Publication 95, MO-210, variant 'AB-1', although some dimensions may be more stringent.
2. All linear dimensions are in millimeters.
3. Coplanarity: 0.12 mm
4. Ball opening size is 0.38 mm (± 0.05 mm)
2. All linear dimensions are in inches (max/min).
3. Dimensions do not include mold flash. Maximum allowable mold flash is .008 inches.
4. Coplanarity: 4 mils.
.553
.547
.048
.042
SST Package Code: NH
SST Package Code: B3K
A B C D E F G H
.042
.048
SEATING PLANE
SIDE VIEW
TOP VIEW
8.00 ± 0.20
TOP VIEW
2
.495
.485
.453
.447
.050
BSC
1
32
0.35 ± 0.05
6.00 ± 0.20
1.10 ± 0.10
.032
.026
.050
BSC
.020 R.
MAX.
0.12
.029
.023
21
x 30˚
4.00
0.80
SIDE VIEW
.112
.106
.140
.125
H G F E D C B A
.095
.075
.021
.013
BOTTOM VIEW
.040
.030
.400
BSC
.015 Min.
R.
5.60
.530
.490
0.80
BOTTOM VIEW
A1 CORNER
6
5
4
3
2
1
48-tfbga-B3K-6x8-450mic-4
1mm
0.45 ± 0.05
(48X)
.032
.026
S71150-14-000
32-plcc-NH-3
Data Sheet
01/10