NFL21SP706X1C3D Murata Electronics North America, NFL21SP706X1C3D Datasheet - Page 183
NFL21SP706X1C3D
Manufacturer Part Number
NFL21SP706X1C3D
Description
FILTER LC HIGH FREQ 76PF 0805
Manufacturer
Murata Electronics North America
Series
EMIFIL®, NFL21SPr
Datasheets
1.NFL21SP307X1C3D.pdf
(2 pages)
2.NFL21SP307X1C3D.pdf
(1 pages)
3.NFL21SP307X1C3D.pdf
(209 pages)
Specifications of NFL21SP706X1C3D
Center / Cutoff Frequency
70MHz
Voltage
16V
Current
150mA
Capacitance
76pF
Filter Type
Low Pass
Package / Case
0805 (2012 Metric)
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Impedance
-
Attenuation Value
-
Other names
490-2541-2
NFM2012K04F706T1
NFM2012K04F706T1
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Part Number:
NFL21SP706X1C3D
Manufacturer:
MURATA/村田
Quantity:
20 000
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PLp Chip Common Mode Choke Coil
(1) Soldering Methods
(2) Soldering Profile
(3) Reworking with Solder Iron
Do not clean after soldering. If cleaning, please contact us.
!Note
3. Standard Soldering Conditions
4. Cleaning
oReflow Soldering Profile
Use reflow soldering methods only.
Use standard soldering conditions when soldering
common mode choke
In cases where several different parts are soldered, each
having different soldering conditions, use those
conditions requiring the least heat and minimum time.
The following conditions must be strictly followed when
using a soldering iron.
Pre-heating: 150 C 60s min.
Soldering iron power output / Tip diameter:
Temperature of soldering iron tip / Soldering time / Times:
(Sn-3.0Ag-0.5Cu Solder)
• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please review our product specifications or consult the approval sheet for product specifications before ordering.
80W max. / ø3mm max.
400 C max. / 5s / 2 times
PLT10H
Series
coils.
220 C min.
Temp. (T1)
Soldering and Mounting
180
150
Heating
30 to 60s
Time. (t1)
Standard Profile
Pre-heating
chip
90s 30s
Temperature
T2
T1
250 3 C
Peak
(T2)
t1
t2
Solder: Use Sn-3.0Ag-0.5Cu solder. Use of Sn-Zn based
Flux:
o Use Rosin-based flux.
o Do not use strong acidic flux (with chlorine content
o Do not use water-soluble flux.
For additional mounting methods, please contact Murata.
of Reflow
time (s)
2 times
exceeding 0.20wt%)
For additional methods of reworking with a soldering iron,
please contact Murata engineering.
Cycle
T4
T3
use Rosin-based flux.
max.
Do not allow the tip of the soldering iron to directly
contact the chip.
Limit Profile
Standard Profile
solder will deteriorate performance of products.
230 C min.
Temp. (T3)
Heating
60s max.
Time. (t2)
Limit Profile
Temperature
260 C/10s
Peak
(T4)
of Reflow
2 times
Cycle
max.
181
Mar.28,2011
C31E.pdf
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