TC1017R-1.8VLTTR Microchip Technology, TC1017R-1.8VLTTR Datasheet
TC1017R-1.8VLTTR
Specifications of TC1017R-1.8VLTTR
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TC1017R-1.8VLTTR Summary of contents
Page 1
... Key performance parameters for the TC1017 include low dropout voltage (285 mV typical at 150 mA output current), low supply current while shutdown (0.05 µA typical) and fast stable response to sudden input voltage and load changes OUT 5 4 TC1017R GND SHDN IN TC1017 SOT-23 V ...
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... Note 3 0.2 %/ 1V) < V & OUTMAX — 100 µA L 200 350 I = 100 mA L 500 I = 150 µA SHDN = µA SHDN = 0V — kHz — µ 5V mA µF, IN OUT f = 100 Hz . DROPOUT for msec. LMAX IN ). Exceeding the maximum allowable power © 2005 Microchip Technology Inc. ...
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... Output current is limited to 120 mA (typ) when V TEMPERATURE CHARACTERISTICS Electrical Specifications: Unless otherwise indicated, V Parameters Temperature Ranges Specified Temperature Range Operating Temperature Range Storage Temperature Range Thermal Package Resistances3 Thermal Resistance, 5L-SOT23 Thermal Resistance, 5L-SC-70 © 2005 Microchip Technology Inc 1V 100 µ 1.0 µF, SHDN > Min Typ — ...
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... FIGURE 2-6: Temperature +25° 2.85V OUT I = 150 mA OUT I = 100 mA OUT OUT - 110 Temperature (°C) Dropout Voltage vs. = 2.85V OUT Input Voltage (V) Short-Circuit Current vs 2.85V OUT 3.85V 3. 110 Temperature (°C) Supply Current vs. © 2005 Microchip Technology Inc. ...
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... Load Regulation vs. Temperature -40 - Temperature (°C) FIGURE 2-9: Supply Current vs. Temperature. © 2005 Microchip Technology Inc 100 µ 1.0 µF, SHDN > 0.40 V 0.35 0.30 0.25 0.20 0.15 0.10 0.05 0.00 125 150 -40 FIGURE 2-10: Temperature 3.30V OUT OUT 59 = 0-150 mA OUT ...
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... Temperature (°C) Output Voltage vs 3.85V 2.85V OUT µ µF OUT OUT 100 1000 10000 100000 1000000 Frequency (Hz) Output Noise vs. Frequency 3.85V OUT = 100 mVp X7R Ceramic OUT = 2.85V 0 100 1000 Frequency (KHz) Power Supply Rejection © 2005 Microchip Technology Inc. ...
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... Power Supply Rejection Ratio vs. Frequency µF Ceramic OUT Shutdow n Input FIGURE 2-20: Wake-Up Response 4.7 µF Ceramic OUT Shutdow n Input FIGURE 2-21: Wake-Up Response. © 2005 Microchip Technology Inc 100 µ 1.0 µF, SHDN > OUT 100 1000 FIGURE 2-22 2.85V OUT ...
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... FIGURE 2-26: Line Transient Response. DS21813D-page 100 µ 1.0 µF, SHDN > µ 120 mA LOAD FIGURE 2-27 µ 100 µA LOAD , T = +25° µ µF Ceramic OUT I = 100 µ 4.3V to 5.3V LOAD 3.33V OUT Line Transient Response. © 2005 Microchip Technology Inc. ...
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... During shutdown, the output voltage falls to zero and the supply current is reduced to 0.05 µA (typ.) 3.2 Ground Terminal For best performance recommended that the ground pin be tied to a ground plane. © 2005 Microchip Technology Inc. Symbol SHDN Shutdown Control Input No Connect NC Ground Terminal ...
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... Control Error Amp V Over R R Temp Feedback Resistors SHDN µF Ceramic TC1017 GND OUT C 1 µF Ceramic OUT remains stable over the entire OUT voltages are available by . For applications where IL more input capacitance can OUT Load © 2005 Microchip Technology Inc. ...
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... SHDN V OUT FIGURE 4-3: Wake-Up Time from Shutdown. © 2005 Microchip Technology Inc. 4.3 Turn-On Response The turn-on response is defined as two separate response categories, wake-up time (t time ( The TC1017 has a fast wake-up time (10 µ ...
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... IN_MAX OUT_MIN LOAD = 4.1V 2.85 – 0.975 120mA = 158.5mW = T – J_MAX JA DMAX = 125 C 158.5mW 450 C/W – = 125 – allowable power dissipation at T – T J_MAX ----------------------------- - 125 – = ---------------------------------- - 450 C/W = 155mW - 110 Ambient Temperature (°C) Power Dissipation vs. © 2005 Microchip Technology Inc. ...
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... IN OUT LOAD power dissipation within the LDO to be: EQUATION 5- – OUT LOAD To determine the maximum power capability, the following equation is used: © 2005 Microchip Technology Inc. EQUATION 5- OUT Where: T J_MAX T A_MAX 110 Given the following example OUT I LOAD ...
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... R thermal resistance, the maximum internal power dissi- pation capability of the package is increased. 85 110 C FIGURE 5-5: Layout. 85 110 . By lowering the JA SHDN OUT GND SC-70 Package Suggested © 2005 Microchip Technology Inc. ...
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... TC1017 – 1.85VLT CQ TC1017 – 1.9VLT CB TC1017 – 2.5VLT CR TC1017 – 2.6VLT CF TC1017 – 2.7VLT CG TC1017 – 2.8VLT CH TC1017 – 2.85VLT CJ TC1017 – 2.9VLT CK TC1017 – 3.0VLT CL TC1017 – 3.2VLT CC TC1017 – 3.3VLT CM TC1017 – 4.0VLT CP TC1017 TC1017R Pinout Code DS21813D-page 15 ...
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... DS21813D-page 16 Part Number Code TC1017 – 1.8VCT DA TC1017 – 1.85VCT DK TC1017 – 2.6VCT DB TC1017 – 2.7VCT DC TC1017 – 2.8VCT DD TC1017 – 2.85VCT DE TC1017 – 2.9VCT DF TC1017 – 3.0VCT DG TC1017 – 3.3VCT DH TC1017 – 4.0VCT DJ Example: DANN © 2005 Microchip Technology Inc. ...
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... Top of Molded Pkg to Lead Shoulder Lead Thickness Lead Width *Controlling Parameter Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .005" (0.127mm) per side. JEITA (EIAJ) Standard: SC-70 Drawing No. C04-061 © 2005 Microchip Technology Inc Units INCHES ...
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... B .014 .017 .020 MILLIMETERS MIN NOM MAX 5 0.95 1.90 0.90 1.18 1.45 0.90 1.10 1.30 0.00 0.08 0.15 2.60 2.80 3.00 1.50 1.63 1.75 2.80 2.95 3.10 0.35 0.45 0. 0.09 0.15 0.20 0.35 0.43 0. © 2005 Microchip Technology Inc. ...
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... Register on our web site (www.microchip.com) to receive the most current information on our products. © 2005 Microchip Technology Inc. Examples: XXXX a) TC1017-1.8VLTTR: 150 mA, Tiny CMOS Package b) TC1017R-1.8VLTTR:150mA, Tiny CMOS c) TC1017-2.6VCTTR: 150 mA, Tiny CMOS d) TC1017-2.7VLTTR: 150 mA, Tiny CMOS e) TC1017-2.8VCTTR: 150 mA, Tiny CMOS f) TC1017-2.85VLTTR:150 mA, Tiny CMOS g) TC1017-2 ...
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... TC1017 NOTES: DS21813D-page 20 © 2005 Microchip Technology Inc. ...
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... PowerCal, PowerInfo, PowerMate, PowerTool, rfLAB, rfPICDEM, Select Mode, Smart Serial, SmartTel, Total Endurance and WiperLock are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. ...
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