UJA1069TW24/5V0/C: NXP Semiconductors, UJA1069TW24/5V0/C: Datasheet - Page 41

• Manufacturer Part Number: UJA1069TW24/5V0/C:
• Description: UJA1069TW24/HTSSOP24/REEL13DP/
• Manufacturer: NXP Semiconductors

Specifications of UJA1069TW24/5V0/C:

• Applications: *
• Interface: *
• Voltage - Supply: *
• Package / Case: 24-TSSOP Exposed Pad, 24-eTSSOP, 24-HTSSOP
• Mounting Type: Surface Mount
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 935285413518

NXP Semiconductors
8. Thermal characteristics
UJA1069_4
Product data sheet
Fig 15. Thermal model of the HTSSOP32 package
Fig 16. Thermal model of the HTSSOP24 package
V1 dissipation
V1 dissipation
Rev. 04 — 28 October 2009
6 K/W
6 K/W
6 K/W
R th(c-a)
6 K/W
R th(c-a)
V3 dissipation
V3 dissipation
23 K/W
17 K/W
T
T
T
T
case
amb
case
amb
(heat sink)
(heat sink)
001aad671
other dissipation
other dissipation
LIN fail-safe system basis chip
001aae136
6 K/W
6 K/W
T
T
vj
vj
UJA1069
© NXP B.V. 2009. All rights reserved.
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