ADV7341BSTZ Analog Devices Inc, ADV7341BSTZ Datasheet - Page 20

• Manufacturer Part Number: ADV7341BSTZ
• Manufacturer: Analog Devices Inc

Specifications of ADV7341BSTZ

• Number Of Dac's: 6
• Adc/dac Resolution: 12b
• Screening Level: Industrial
• Package Type: LQFP
• Pin Count: 64
• Lead Free Status / RoHS Status: Compliant

ADV7340/ADV7341
ABSOLUTE MAXIMUM RATINGS
Table 13.
Parameter
V
V
PV
V
AGND to DGND
AGND to PGND
AGND to GND_IO
DGND to PGND
DGND to GND_IO
PGND to GND_IO
Digital Input Voltage to GND_IO
Analog Outputs to AGND
Maximum CLKIN Input Frequency
Storage Temperature Range (T
Junction Temperature (T
Lead Temperature (Soldering, 10 sec)
1
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
indefinite duration.
Analog output short circuit to any power supply or common can be of an
AA
DD
DD_IO
DD
to AGND
to DGND
to PGND
to GND_IO
1
J
)
S
)
Rating
−0.3 V to +3.9 V
−0.3 V to +2.3 V
−0.3 V to +2.3 V
−0.3 V to +3.9 V
−0.3 V to +0.3 V
−0.3 V to +0.3 V
−0.3 V to +0.3 V
−0.3 V to +0.3 V
−0.3 V to +0.3 V
−0.3 V to +0.3 V
−0.3 V to V
−0.3 V to V
80 MHz
−65°C to +150°C
150°C
260°C
DD_IO
AA
+ 0.3 V
Rev. A | Page 20 of
The ADV7340/ADV7341 are high performance integrated
circuits with an ESD rating of <1 kV, and they are ESD sensitive.
Proper precautions should be taken for handling and assembly.
THERMAL RESISTANCE
soldered in a circuit board for surface-mount packages.
Table 14. Thermal Resistance
Package Type
64-Lead LQFP
1
The ADV7340/ADV7341 are RoHS-compliant, Pb-free products.
The lead finish is 100% pure Sn electroplate. The devices are
suitable for Pb-free applications up to 255°C (±5°C) IR reflow
(JEDEC STD-20).
Each part is backward compatible with conventional SnPb
soldering processes. The electroplated Sn coating can be soldered
with Sn/Pb solder paste at conventional reflow temperatures of
220°C to 235°C.
ESD CAUTION
θ
Values are based on a JEDEC 4-layer test board.
108
JA
is specified for the worst-case conditions, that is, a device
1
θ
47
JA
θ
11
JC
Unit
°C/W