MMA7331LCT Freescale, MMA7331LCT Datasheet - Page 8

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MMA7331LCT

Manufacturer Part Number
MMA7331LCT
Description
Manufacturer
Freescale
Datasheet

Specifications of MMA7331LCT

Lead Free Status / RoHS Status
Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MMA7331LCT
Manufacturer:
MICRON
Quantity:
1 200
Part Number:
MMA7331LCT
Manufacturer:
FREESCAL
Quantity:
2 500
PCB Mounting Recommendations
Board (PCB) reflow processes. For optimal zero-g offset after
PCB mounting, care must be taken to PCB layout and reflow
conditions. Reference application note AN3484 for best
practices to minimize the zero-g offset shift after PCB
mounting.
design. The footprint for the surface mount packages must be
the correct size to ensure proper solder connection interface
between the board and the package.
subjected to a solder reflow process. It is always
recommended to design boards with a solder mask layer to
avoid bridging and shorting between solder pads.
8
MMA7331L
MEMS based sensors are sensitive to Printed Circuit
Surface mount board layout is a critical portion of the total
With the correct footprint, the packages will self-align when
MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS
14x0.6
10x0.8
14x0.9
Figure 8. LGA 14-Lead, 5 x 3 mm Die Sensor
1
6
Freescale Semiconductor
12x1
8
13
Sensors
6x2

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