M36L0R8060T1ZAQF STMicroelectronics, M36L0R8060T1ZAQF Datasheet - Page 16
M36L0R8060T1ZAQF
Manufacturer Part Number
M36L0R8060T1ZAQF
Description
Manufacturer
STMicroelectronics
Datasheet
1.M36L0R8060T1ZAQF.pdf
(18 pages)
Specifications of M36L0R8060T1ZAQF
Operating Supply Voltage (max)
1.95V
Operating Temperature (max)
85C
Mounting
Surface Mount
Lead Free Status / RoHS Status
Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
M36L0R8060T1ZAQF
Manufacturer:
ST
Quantity:
5 576
M36L0R8060T1, M36L0R8060B1
PART NUMBERING
Table 10. Ordering Information Scheme
Example:
M36 L 0 R 8 0 6 0 T 1 ZAQ T
Device Type
M36 = Multi-Chip Package (Multiple Flash + RAM)
Flash 1 Architecture
L = Multilevel, Multiple Bank, Burst mode
Flash 2 Architecture
0 = No Die
Operating Voltage
R = V
= V
= V
= 1.7 to 1.95V
DDF
CCP
DDQF
Flash 1 Density
8 = 256 Mbits
Flash 2 Density
0 = No Die
RAM 1 Density
6 = 64 Mbits
RAM 0 Density
0 = No Die
Parameter Blocks Location
T = Top Boot Block Flash
B = Bottom Boot Block Flash
Product Version
1 = 0.13µm Flash Technology Multi-Level Design, 85ns speed;
0.11µm PSRAM, 70ns speed, burst mode
Package
ZAQ = Stacked TFBGA88 8x10mm - 8x10 active ball array, 0.8mm pitch
Option
Blank = Standard Packing
T = Tape & Reel Packing
E = Lead-free and RoHS Standard packing
F = Lead-free and RoHS Tape & Reel packing
Devices are shipped from the factory with the memory content bits erased to ’1’. For a list of available op-
tions (Speed, Package, etc.) or for further information on any aspect of this device, please contact the ST-
Microelectronics Sales Office nearest to you.
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