MT48LC4M32B2P-7IT Micron Technology Inc, MT48LC4M32B2P-7IT Datasheet - Page 67
![no-image](/images/manufacturer_photos/0/4/441/micron_technology_inc_sml.jpg)
MT48LC4M32B2P-7IT
Manufacturer Part Number
MT48LC4M32B2P-7IT
Description
Manufacturer
Micron Technology Inc
Type
SDRAMr
Datasheet
1.MT48LC4M32B2P-7IT.pdf
(67 pages)
Specifications of MT48LC4M32B2P-7IT
Organization
4Mx32
Density
128Mb
Address Bus
14b
Access Time (max)
17/8/5.5ns
Maximum Clock Rate
143MHz
Operating Supply Voltage (typ)
3.3V
Package Type
TSOP-II
Operating Temp Range
-40C to 85C
Operating Supply Voltage (max)
3.6V
Operating Supply Voltage (min)
3V
Supply Current
175mA
Pin Count
86
Mounting
Surface Mount
Operating Temperature Classification
Industrial
Lead Free Status / RoHS Status
Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
MT48LC4M32B2P-7IT
Manufacturer:
MICRON
Quantity:
3 578
Company:
Part Number:
MT48LC4M32B2P-7IT:G
Manufacturer:
MICRON
Quantity:
6 710
Figure 50:
PDF: 09005aef80872800/Source: 09005aef80863355
128MbSDRAMx32_2.fm - Rev. L 1/09 EN
Micron, the M logo, and the Micron logo are trademarks of Micron Technology, Inc. All other trademarks are the property of
This data sheet contains minimum and maximum limits specified over the complete power supply and temperature range
SEATING PLANE
DIMENSIONS APPLY
TO SOLDER BALLS POST
REFLOW. THE PRE-
REFLOW DIAMETER IS
0.42 ON A 0.40 SMD
BALL PAD
for production devices. Although considered final, these specifications are subject to change, as further product
11.20 ±0.10
90X Ø0.45
0.10 A
90-Ball VFBGA (8mm x 13mm)
BALL A9
5.60 ±0.05
Notes:
prodmktg@micron.com www.micron.com Customer Comment Line: 800-932-4992
A
0.65 ±0.05
8000 S. Federal Way, P.O. Box 6, Boise, ID 83707-0006, Tel: 208-368-3900
1. All dimensions in millimeters.
2. Package width and length do not include mold protrusion; allowable mold protrusion is
3. Recommended pad size for PCB is 0.33mm ±0.025mm.
0.25mm per side.
3.20
development and data characterization sometimes occur.
8.00 ±0.10
6.40
C L
4.00 ±0.05
their respective owners.
C L
6.50 ±0.05
0.80 TYP
BALL A1 ID
BALL A1
67
13.00 ±0.10
®
Micron Technology, Inc., reserves the right to change products or specifications without notice.
1.00 MAX
SOLDER BALL MATERIAL:
SUBSTRATE MATERIAL:
MOLD COMPOUND:
62% Sn, 36% Pb, 2% Ag OR
96.5% Sn, 3%Ag, 0.5% Cu
PLASTIC LAMINATE
EPOXY NOVOLAC
Package Dimensions
©2001 Micron Technology, Inc. All rights reserved.
128Mb: x32 SDRAM
BALL A1 ID