AM29F010B-45EI Spansion Inc., AM29F010B-45EI Datasheet - Page 33

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AM29F010B-45EI

Manufacturer Part Number
AM29F010B-45EI
Description
Manufacturer
Spansion Inc.
Datasheet

Specifications of AM29F010B-45EI

Cell Type
NOR
Density
1Mb
Access Time (max)
45ns
Interface Type
Parallel
Boot Type
Not Required
Address Bus
17b
Operating Supply Voltage (typ)
5V
Operating Temp Range
-40C to 85C
Package Type
TSOP
Program/erase Volt (typ)
4.75 to 5.25V
Sync/async
Asynchronous
Operating Temperature Classification
Industrial
Operating Supply Voltage (min)
4.75V
Operating Supply Voltage (max)
5.25V
Word Size
8b
Number Of Words
128K
Supply Current
30mA
Mounting
Surface Mount
Pin Count
32
Lead Free Status / RoHS Status
Not Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
AM29F010B-45EI
Manufacturer:
AMD
Quantity:
14
REVISION SUMMARY
Revision A (August 12, 1999)
Initial release. Th e Am29 F010 B replaces the
Am29F010A data sheet (22181B+1).
Revision A+1 (September 22, 1999)
Device Bus Operations
Sector Protection/Unprotection: Corrected the publica-
tion number for the programming supplement.
Revision A+2 (September 27, 1999)
Erase and Programming Performance table
In Notes 1 and 6, corrected the erase cycle endurance
to 1 million cycles.
Revision B (November 12, 1999)
AC Characteristics—Figure 9. Program Operations
Timing and Figure 10. Chip/Sector Erase
Operations
Deleted t
high.
Physical Dimensions
Replaced figures with more detailed illustrations.
Revision C (November 28, 2000)
Global
Added table of contents. Removed Preliminary status
from document.
Ordering Information
Deleted burn-in option.
Colophon
The products described in this document are designed, developed and manufactured as contemplated for general use, including without limita-
tion, ordinary industrial use, general office use, personal use, and household use, but are not designed, developed and manufactured as con-
templated (1) for any use that includes fatal risks or dangers that, unless extremely high safety is secured, could have a serious effect to the
public, and could lead directly to death, personal injury, severe physical damage or other loss (i.e., nuclear reaction control in nuclear facility,
aircraft flight control, air traffic control, mass transport control, medical life support system, missile launch control in weapon system), or (2) for
any use where chance of failure is intolerable (i.e., submersible repeater and artificial satellite). Please note that Spansion Inc. will not be liable
to you and/or any third party for any claims or damages arising in connection with above-mentioned uses of the products. Any semiconductor
devices have an inherent chance of failure. You must protect against injury, damage or loss from such failures by incorporating safety design
measures into your facility and equipment such as redundancy, fire protection, and prevention of over-current levels and other abnormal operating
conditions. If any products described in this document represent goods or technologies subject to certain restrictions on export under the Foreign
Exchange and Foreign Trade Law of Japan, the US Export Administration Regulations or the applicable laws of any other country, the prior au-
thorization by the respective government entity will be required for export of those products
Trademarks
Copyright ©1997-2006 Advanced Micro Devices, Inc. All rights reserved. AMD, the AMD logo, and combinations thereof are registered trade-
marks of Advanced Micro Devices, Inc. ExpressFlash is a trademark of Advanced Micro Devices, Inc. Product names used in this publication are
for identification purposes only and may be trademarks of their respective companies.
Copyright ©2006-2009 Spansion Inc. All rights reserved. Spansion
ORNAND2
used are for informational purposes only and may be trademarks of their respective owners.
March 2, 2006 Am29F010B_00_C8
GHWL
, HD-SIM
and changed OE# waveform to start at
, EcoRAM
and combinations thereof, are trademarks of Spansion LLC in the US and other countries. Other names
D A T A
Am29F010B
®
, the Spansion Logo, MirrorBit
S H E E T
Revision C+1 (November 18, 2002)
Ordering Information
Deleted the PE (PDIP, Extended Temperature Range)
combination from the 45, 55, and 70 ns speed options.
Operating Ranges
Changed Case Temperature to Ambient Temperature.
Revision C+2 (September 22, 2004)
Added PB-Free option to Standard Ordering Matrix.
Updated Valid Combinations
Revision C+3 (April 5, 2005)
Added PE nomenclature to Valid Combinations.
Revision C+4 (August 23, 2005)
Added Pb-free option for PLCC and PDIP packages.
Revision C+5 (January 4, 2006)
Deleted TSR032 32-pin Reverse TSOP option.
Revision C6 (July 27, 2006)
Added notice to first page of data sheet and cover
page.
Revision C7 (October 31, 2006)
Removed notice to first page of data sheet and cover
page.
Revision C8 (March 2, 2009)
Global
Added obsolescence information.
®
, MirrorBit
®
Eclipse
, ORNAND
,
31

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