W86L157SYG Winbond, W86L157SYG Datasheet - Page 9

• Manufacturer Part Number: W86L157SYG
• Manufacturer: Winbond

Specifications of W86L157SYG

• Lead Free Status / RoHS Status: Compliant

4.2 W86L157SY Pin Descriptions (48-pin)
MMC Interface:
Flash Memory Interface Signal:
36, 35, 34,
33, 29, 28,
27, 26
PIN
48
40
41
46
38
10
11
12
20
9
4
5
6
1
2
3
DAT/CDO
CMD/CDI
FIO[7:0]
FSCMR
FWEN
FWPN
CSCN
CSDN
NAME
CSAN
CSBN
FREN
FTMN
FCLE
FALE
FR_B
CLK
CS
DO/DIO
DO/DIO
DO/DIO
DO/DIO
DO/DIO
DO/DIO Read Enable of flash memory.
DB/DO
DI/DIO
DI/DIO
DI/DO
DO/DI
DO/DI
DO/DI
DB/DI
DB/DI
DI/DI/
TYPE
DI
DI
Command, Address or Data lines of flash memory.
MMC mode: Data line
SPI mode: Card data output.
SPI mode: Card select input, active low.
MMC mode: Command response.
SPI mode: Card data input.
Clock input signal of MMC card.
Command Latch Enable of flash memory
Write Enable of flash memory
Write Protect of flash memory
Chip select output pin of flash memory A, active low.
Flash Single ComMand Read set in flash memory, If the flash
ID number can not recognized, flash memory is single
command read if this pin is high and is two command read if
low. Always input when flash memory select.
Address Latch Enable of flash memory
Chip select output pin of flash memory B, active low and input
during reset. This pin is disable and single flash is connected
if input low during reset. Weak pull high is drive and will
change to weak pull low when single flash is used.
Chip select output pin of flash memory C, active low and input
during reset. Weak pull high is drive and will change to weak
pull low when 4 flashs are used.
Chip select output pin of flash memory D, active low and input
during reset. Weak pull hign is drive and will change to weak
pull low when 4 flashs are used.
Ready/Busy state output of flash memory.
Force memory in Transparency Mode.
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DESCRIPTION
W86L157 Preliminary