MCM69C433TQ15 Freescale, MCM69C433TQ15 Datasheet - Page 4
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MCM69C433TQ15
Manufacturer Part Number
MCM69C433TQ15
Description
Manufacturer
Freescale
Datasheet
1.MCM69C433TQ15.pdf
(24 pages)
Specifications of MCM69C433TQ15
Operating Temperature (max)
85C
Package Type
TQFP
Mounting
Surface Mount
Operating Temperature Classification
Commercial
Lead Free Status / RoHS Status
Not Compliant
MCM69C433 SCM69C433
4
NOTES:
* V IL (min) = –3.0 V ac (pulse width
NOTES:
ABSOLUTE MAXIMUM RATINGS
RECOMMENDED OPERATING CONDITIONS
DC CHARACTERISTICS AND SUPPLY CURRENTS
PACKAGE THERMAL CHARACTERISTICS
Supply Voltage (see Note 2)
Voltage Relative to V SS (see Note 2)
Output Current per Pin
Package Power Dissipation (see Note 3)
Temperature Under Bias (see Note 3)
Operating Temperature
Storage Temperature
Power Supply Voltage
Operating Temperature (Junction)
Input Low Voltage
Input High Voltage
Active Power Supply Current
Input Leakage Current (0 V
Output Leakage Current (0 V
Output Low Voltage (I OL = 8 mA)
Output High Voltage (I OH = –4 mA)
Thermal Resistance Junction to Ambient (200 lfpm, 4 Layer Board) (see Note 2)
Thermal Resistance Junction to Board (Bottom) (see Note 3)
Thermal Resistance Junction to Case (Top) (see Note 4)
1. Permanent device damage may occur if ABSOLUTE MAXIMUM RATINGS are
2. All voltages are referenced to V SS .
3. Power dissipation capability will be dependent upon package characteristics and use
1. RAM junction temperature is a function of on–chip power dissipation, package thermal impedance, mounting site temperature, and
2. Per SEMI G38–87.
3. Indicates the average thermal impedance between the die and the mounting surface.
4. Indicates the average thermal impedance between the die and the case top surface. Measured via the cold plate method (MIL SPEC–883
exceeded. Functional operation should be restricted to RECOMMENDED OPER-
ATING CONDITIONS. Exposure to higher than recommended voltages for extended
periods of time could affect device reliability.
environment. See Package Thermal Characteristics.
mounting site thermal impedance.
Method 1012.1).
Rating
v
Commercial
Commercial
v
V in
Parameter
Industrial
Industrial
V in
DC OPERATING CONDITIONS AND CHARACTERISTICS
v
v
v
Freescale Semiconductor, Inc.
V DD )
(V DD = 3.3 V 5%, T J < 120 C, Unless Otherwise Noted)
20 ns).
Parameter
(See Note 1)
V DD )
For More Information On This Product,
Symbol
T bias
V DD
T stg
Rating
I out
V in
P D
T A
Go to: www.freescale.com
(Voltages Referenced to V SS = 0 V)
–0.5 to V DD + 3 V
–55 to 125
–10 to 85
–40 to 85
–40 to 85
0 to 70
Value
4.6
—
20
Symbol
Unit
V DD
mA
V IH
V IL
W
V
V
T J
C
C
C
Symbol
I lkg (O)
I lkg (I)
I DDA
V OH
V OL
inputs against damage due to high static volt-
ages or electric fields; however, it is advised
that normal precautions be taken to avoid
application of any voltage higher than maxi-
mum rated voltages to this high–impedance
circuit.
–0.5*
Min
3.1
2.2
This device contains circuitry to protect the
—
Symbol
R JA
R JB
R JC
MOTOROLA FAST SRAM
Typ
Min
3.3
2.4
—
—
—
—
—
0
3
Max
Max
Max
120
300
3.5
0.8
5.5
0.4
36
19
—
8
1
1
Unit
Unit
Unit
mA
C/W
C/W
C/W
V
V
V
V
V
C
A
A