MT9HTF6472CHY-667F1 Micron Technology Inc, MT9HTF6472CHY-667F1 Datasheet
MT9HTF6472CHY-667F1
Specifications of MT9HTF6472CHY-667F1
Related parts for MT9HTF6472CHY-667F1
MT9HTF6472CHY-667F1 Summary of contents
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... Micron Technology, Inc., reserves the right to change products or specifications without notice. 1 200-Pin SOCDIMM (MO-274 R ≤ +70°C) A ≤ +85° module offerings. 2. Contact Micron for product availability. 3. Not recommended for new designs RCD (ns) (ns) – 12.5 12.5 – ...
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... Part Numbers and Timing Parameters – 512MB Modules Base device: MT47H64M8, Module 2 Part Number Density MT9HTF6472CHY-80E__ 512MB MT9HTF6472CHY-800__ 512MB MT9HTF6472CHY-667__ 512MB 512MB MT9HTF6472CHY-53E__ Table 4: Part Numbers and Timing Parameters – 1GB Modules Base device: MT47H128M8, Module 2 Part Number Density MT9HTF12872CHY-80E__ 1GB 1GB MT9HTF12872CHY-800__ 1GB ...
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Pin Assignments and Descriptions Table 5: Pin Assignments 200-Pin SOCDIMM Front Pin Symbol Pin Symbol Pin Symbol Pin Symbol DQ18 101 REF 3 DQ0 53 DQ19 103 105 DQ1 57 ...
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... LOAD MODE command. Serial presence-detect data: SDA is a bidirectional pin used to transfer addresses and data into and out of the presence-detect portion of the module. Temperature sensor alarm output: The event pin is used to flag critical module temperatures. Power supply: +1.8V ±0.1V. ...
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Functional Block Diagram Figure 2: Functional Block Diagram S0# DQS0# DQS0 DM0 DM DQ0 DQ DQ1 DQ DQ2 DQ DQ3 DQ DQ4 DQ DQ5 DQ DQ6 DQ DQ7 DQ DQS1# DQS1 DM1 DM DQ8 DQ DQ9 DQ DQ10 DQ DQ11 ...
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... DQS, and output data is referenced to both edges of DQS, as well as to both edges of CK. PLL Operation A PLL chip on the module receives and redrives the differential clock signals (CK, CK#) to the DDR2 SDRAM devices. The PLL minimizes system clock line loading. PLL clock timing is defined by JEDEC specifications and is ensured by the use of a JEDEC clock reference board ...
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... Electrical Specifications Stresses greater than those listed in Table 7 may cause permanent damage to the module. This is a stress rating only, and functional operation of the module at these or any other conditions outside those indicated on the device data sheet is not implied. Exposure to absolute maximum rating conditions for extended periods may adversely affect reliability ...
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I Specifications DD Table 9: DDR2 I Specifications and Conditions – 512MB DD Values are shown for the MT9HTF6472 DDR2 SDRAM only and are computed from the values specified in the 512Mb (64 Meg x 8) component data sheet Parameter/Condition ...
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Table 10: DDR2 I Specifications and Conditions – 1GB DD Values are shown for the MT9HTF12872 DDR2 SDRAM only and are computed from the values specified in the 1Gb (128 Meg x 8) component data sheet Parameter/Condition Operating one bank ...
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PLL Specifications Table 11: PLL Device Specifications CUA845 device or JESD82-21 equivalent Parameter Symbol V DC high-level input voltage V DC low-level input voltage Input voltage (limits high-level input voltage low-level input voltage V Input ...
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... Temperature Sensor The temperature sensor continuously monitors the module’s temperature and can be read back at any time over the I the “Mobile Platform Memory Module Thermal Sensor Component Specification,” which is found in JEDEC standard JESD21-C. Table 13: Temperature Sensor Specifications Parameter/Condition Supply voltage Average operating supply current Input high voltage: Logic 1 ...
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Serial Presence-Detect Table 15: Serial Presence-Detect EEPROM DC Operating Conditions Parameter/Condition Supply voltage with temperature sensor option Input high voltage: Logic 1; All inputs Input low voltage: Logic 0; All inputs Output low voltage 3mA OUT SPD input ...
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... TYP 11.40 (0.45) 16.26 (0.64) ® property of their respective owners. characterization sometimes occur. Micron Technology, Inc., reserves the right to change products or specifications without notice. 13 Module Dimensions 3.8 (0.150) MAX U8 30.15 (1.187) 29.85 (1.175) 20.0 (0.787) TYP 1.1 (0.043) 0.9 (0.035) Pin 199 10 ...