M368L3223HUS-CCC Samsung Semiconductor, M368L3223HUS-CCC Datasheet - Page 15

• Manufacturer Part Number: M368L3223HUS-CCC
• Manufacturer: Samsung Semiconductor

Specifications of M368L3223HUS-CCC

• Lead Free Status / RoHS Status: Compliant

13.0 System Characteristics for DDR SDRAM
The following specification parameters are required in systems using DDR333 devices to ensure proper system performance. these
characteristics are for system simulation purposes and are guaranteed by design.
Table 1 : Input Slew Rate for DQ, DQS, and DM
Table 2 : Input Setup & Hold Time Derating for Slew Rate
Table 3 : Input/Output Setup & Hold Time Derating for Slew Rate
Table 4 : Input/Output Setup & Hold Derating for Rise/Fall Delta Slew Rate
Table 5 : Output Slew Rate Characteristice (X4, X8 Devices only)
Table 6 : Output Slew Rate Characteristice (X16 Devices only)
Table 7 : Output Slew Rate Matching Ratio Characteristics
256MB, 512MB Unbuffered DIMM
AC CHARACTERISTICS
PARAMETER
DQ/DM/DQS input slew rate measured between
V
AC CHARACTERISTICS
PARAMETER
Output Slew Rate Matching Ratio (Pullup to Pulldown)
IH
Slew Rate Characteristic
Slew Rate Characteristic
(DC), V
Input Slew Rate
Input Slew Rate
Delta Slew Rate
+/- 0.25 V/ns
+/- 0.0 V/ns
+/- 0.5 V/ns
Pullup Slew Rate
Pullup Slew Rate
0.5 V/ns
0.4 V/ns
0.3 V/ns
0.5 V/ns
0.4 V/ns
0.3 V/ns
Pulldown slew
Pulldown slew
IL
(DC) and V
IL
(DC), V
+100
∆tDS
+150
∆tDS
+100
∆tIS
+50
+75
+50
0
0
0
IH
Typical Range
Typical Range
(DC)
1.2 ~ 2.5
1.2 ~ 2.5
1.2 ~ 2.5
1.2 ~ 2.5
(V/ns)
(V/ns)
∆tDH
∆tDH
+150
+100
∆tIH
+75
+50
0
0
0
0
0
Minimum
Minimum
(V/ns)
(V/ns)
1.0
1.0
0.7
0.7
SYMBOL
DCSLEW
TBD
MIN
DDR400
Units
Units
Units
ps
ps
ps
ps
ps
ps
ps
ps
ps
Maximum
Maximum
MAX
TBD
TBD
MIN
(V/ns)
(V/ns)
13 of 20
4.5
4.5
5.0
5.0
DDR400
Notes
Notes
Notes
TBD
MIN
MAX
TBD
k
k
k
i
i
i
j
j
j
DDR333
a,c,d,f,g,h
b,c,d,f,g,h
a,c,d,f,g,h
b,c,d,f,g,h
Notes
Notes
MAX
TBD
TBD
MIN
DDR333
MAX
TBD
Notes
e, l
Rev. 1.01 August 2008
Units
V/ns
Notes
a, l
DDR SDRAM