HSDL-3201#001 Lite-On Electronics, HSDL-3201#001 Datasheet - Page 11

Infrared Transceivers IR Transceiver 115.2Kb/s

HSDL-3201#001

Manufacturer Part Number
HSDL-3201#001
Description
Infrared Transceivers IR Transceiver 115.2Kb/s
Manufacturer
Lite-On Electronics
Type
TX/RXr
Series
-r
Datasheet

Specifications of HSDL-3201#001

Pulse Width
1.6/2.45us
Led Supply Voltage
2.7 to 6V
Dimensions
8x3x2.5
Peak Wavelength
875/880nm
Angle Of Half Sensitivity
60/30°
Communication Distance
30
Package Type
Ultra Small Profile
Fall Time
600/25ns
Rise Time
600/20ns
Operating Supply Voltage (typ)
3.3V
Operating Supply Voltage (min)
2.7V
Operating Supply Voltage (max)
3.6V
Mounting
Surface Mount
Pin Count
9
Operating Temp Range
-25C to 85C
Operating Temperature Classification
Commercial
Data Rate
115.2Kbps
Wavelength
875 nm, 880 nm
Continual Data Transmission
115.2 Kbit/s
Transmission Distance
30 cm
Radiant Intensity
9 mW/sr
Half Intensity Angle Degrees
30 deg to 60 deg
Maximum Rise Time
120 ns, 600 ns
Maximum Fall Time
80 ns, 600 ns
Operating Voltage
2.7 V to 3.6 V
Maximum Operating Temperature
+ 85 C
Minimum Operating Temperature
- 25 C
Package / Case
Ultra Small Profile
Idle Current, Typ @ 25° C
100µA
Link Range, Low Power
30cm
Operating Temperature
-25°C ~ 85°C
Orientation
Side View
Shutdown
Yes
Size
8mm x 3mm x 2.5mm
Standards
IrPHY 1.2
Supply Voltage
2.7 V ~ 3.6 V
Lead Free Status / RoHS Status
Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
HSDL-3201#001HSDL-3201
Manufacturer:
AVAGO
Quantity:
37 500
Company:
Part Number:
HSDL-3201#001
Manufacturer:
AGILENT
Quantity:
250 000
Company:
Part Number:
HSDL-3201#001
Manufacturer:
AVAGO/安华高
Quantity:
20 000
Company:
Part Number:
HSDL-3201#001HSDL-3201#008
Manufacturer:
Agilent
Quantity:
10 000
Company:
Part Number:
HSDL-3201#001HSDL-3201#008
Manufacturer:
AVAGO/安华高
Quantity:
20 000
Moisture Proof Packaging
The HDSL-3201 is shipped in moisture
proof packaging. Once opened,
moisture absorption begins.
This part is compliant to JEDEC Level
4.
Recommended Storage
Conditions
Storage
Temperature
Relative
Humidity
Time from Unsealing to
Soldering
After removal from the bag, the parts
should be soldered within three days
if stored at the recommended storage
conditions.
Baking
If the parts are not stored in dry
conditions, they must be baked
before reflow to prevent damage to
the parts.
Package
In reels
In bulk
Baking should only be done once.
11
3.
Temp.
100 C
125 C
150 C
60 C
10 C to 30 C
below 60% RH
Time
48 hours
4 hours
2 hours
1 hour
7
Recommended Land Pattern for HSDL-3201#021
(Front Options)
Recommended Land Pattern for HSDL-3201#008
(Top Options)
1.275
1.75
0.60
0.60
0.10
UNIT: mm
MOUNTING
2.20
CENTER
3.625
PITCH 7 x 0.95
0.9
0.475
1.45
MOUNTING CENTER
C L
1.425
1.35
2.375
3.325
1.25
SHIELD
SOLDER PAD
1.60
0.575
0.775
2.05
FIDUCIAL

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