TFDU4100 Vishay, TFDU4100 Datasheet - Page 7

• Manufacturer Part Number: TFDU4100
• Manufacturer: Vishay
• Type: TX/RXr

Specifications of TFDU4100

• Peak Wavelength: 900nm
• Angle Of Half Sensitivity: 48°
• Pulse Width: 4us
• Led Supply Voltage: -0.5 to 6V
• Package Type: Ultra Small Profile
• Fall Time: 600/200ns
• Rise Time: 600/1400ns
• Dimensions: 9.7x4.7x4
• Operating Supply Voltage (typ): 2.5/3.3/5V
• Operating Supply Voltage (min): 2/2.7V
• Operating Supply Voltage (max): 5.5V
• Mounting: Surface Mount
• Pin Count: 8
• Operating Temp Range: -25C to 85C
• Operating Temperature Classification: Commercial
• Data Rate: 115.2Kbps
• Lead Free Status / RoHS Status: Compliant

Recommended Solder Profiles
Solder Profile for Sn/Pb Soldering
Lead (Pb)-Free, Recommended Solder Profile
The TFDU4100 is a lead (Pb)-free transceiver and
qualified for lead (Pb)-free processing. For lead (Pb)-
free solder paste like Sn (3.0 - 4.0) Ag (0.5 - 0.9) Cu,
there are two standard reflow profiles: Ramp-Soak-
Spike (RSS) and Ramp-To-Spike (RTS). The Ramp-
Soak-Spike profile was developed primarily for reflow
ovens heated by infrared radiation. With widespread
use of forced convection reflow ovens the Ramp-To-
Spike profile is used increasingly. Shown below in fig-
ure 6 and 7 are VISHAY's recommended profiles for
use with the TFDU4100 transceivers. For more
details please refer to the application note
“SMD Assembly Instructions”
(http://www.vishay.com/docs/82602/82602.pdf).
A ramp-up rate less than 0.9 °C/s is not recom-
mended. Ramp-up rates faster than 1.3 °C/s could
damage an optical part because the thermal conduc-
tivity is less than compared to a standard IC.
Wave Soldering
For TFDUxxxx and TFBSxxxx transceiver devices
wave soldering is not recommended.
Manual Soldering
Manual soldering is the standard method for lab use.
However, for a production process it cannot be rec-
ommended because the risk of damage is quite highly
depending on the experience of the operator. Never-
theless, we added a chapter to the above mentioned
application note, describing manual soldering and
desoldering.
Document Number 82514
Rev. 1.6, 03-Jul-06
19535
Figure 6. Recommended Solder Profile for Sn/Pb soldering
260
240
220
200
180
160
140
120
100
80
60
40
20
0
0
2...4 °C/s
50
100
160 °C max.
120 s...180 s
240 °C max.
150
Time/s
200
2...4 °C/s
10 s max. at 230 °C
90 s max.
250
300
350
Storage
The storage and drying processes for all VISHAY
transceivers (TFDUxxxx and TFBSxxx) are equiva-
lent to MSL4.
The data for the drying procedure is given on labels
on the packing and also in the application note
"Taping, Labeling, Storage and Packing"
(http://www.vishay.com/docs/82601/82601.pdf).
Current Derating Diagram
19532
275
250
225
200
175
150
125
100
280
260
240
220
200
180
160
140
120
100
75
50
25
80
60
40
20
0
0
0
0
14880
Figure 7. Solder Profile, RSS Recommendation
2 °C...3 °C/s
600
500
400
300
200
100
0
50
Figure 9. Current Derating Diagram
–40 –20 0
T ≥ 217 °C for 70 s max
50
T ≥ 255 °C for 10 s....30 s
Figure 8. RTS Recommendation
Current derating as a function of
the maximum forward current of
IRED. Maximum duty cycle: 25 %.
100
1.3 °C/s
100
90 s...120 s
T
peak
Time above 217 °C t ≤ 70 s
Time above 250 °C t ≤ 40 s
Peak temperature T
20 40 60 80 100 120 140
Temperatur (5 °C)
Vishay Semiconductors
= 260 °C max
150
Time/s
Time/s
150
200
peak
= 260 °C
30 s max.
70 s max.
200
TFDU4100
< 4 °C/s
250
www.vishay.com
T peak = 260 °C
< 2 °C/s
2 °C...4 °C/s
250
300
350
300
7