HSDL-3220-021 Lite-On Electronics, HSDL-3220-021 Datasheet - Page 10

• Manufacturer Part Number: HSDL-3220-021
• Description: Infrared Transceivers IR Transceiver
• Manufacturer: Lite-On Electronics

Specifications of HSDL-3220-021

• Wavelength: 875 nm, 880 nm
• Continual Data Transmission: 4 Mbit/s
• Transmission Distance: 50 cm
• Radiant Intensity: 45 mW/sr
• Half Intensity Angle Degrees: 30 deg to 60 deg
• Pulse Width: 4 us, 1.6 us
• Maximum Rise Time: 60 ns, 600 ns
• Maximum Fall Time: 60 ns, 600 ns
• Led Supply Voltage: 0 V to 6.5 V
• Maximum Forward Current: 50 mA
• Operating Voltage: 2.7 V to 3.6 V
• Maximum Operating Temperature: + 70 C
• Minimum Operating Temperature: - 25 C
• Dimensions: 8 mm x 3 mm x 2.5 mm
• Data Rate: 4Mbs (FIR)
• Idle Current, Typ @ 25° C: 1.8 mA
• Link Range, Low Power: 1m
• Operating Temperature: -25°C ~ 70°C
• Orientation: Side View
• Shutdown: *
• Size: 8mm x 3mm x 2.5mm
• Standards: IrPHY 1.4
• Supply Voltage: 2.7 V ~ 3.6 V
• Lead Free Status / RoHS Status: Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Compliant

Recommended Reflow Profile
Process Zone
Heat Up
Solder Paste Dry
Solder Reflow
Cool Down
The reflow profile is a straight-line representation of a
nominal temperature profile for a convective reflow sol-
der process. The temperature profile is divided into four
process zones, each with different ∆T/∆time temperature
change rates. The ∆T/∆time rates are detailed in the
above table. The temperatures are measured at the com-
ponent to printed circuit board connections.
In process zone P1, the PC board and HSDL-3220 cas-
tellation pins are heated to a temperature of 160°C to
activate the flux in the solder paste. The temperature
ramp up rate, R1, is limited to 4°C per second to allow
for even heating of both the PC board and HSDL-3220
castellations.
Process zone P2 should be of sufficient time duration
(60 to 120 seconds) to dry the solder paste. The tem-
perature is raised to a level just below the liquidus point
of the solder, usually 200°C (392°F).
10
255
230
220
200
180
160
120
80
25
0
HEAT
R1
UP
P1
50
SOLDER PASTE DRY
R2
Symbol
P1, R1
P2, R2
P3, R3
P3, R4
P4, R5
P2
100
t-TIME (SECONDS)
150
MAX. 260 C
R3
60 sec.
ABOVE
REFLOW
SOLDER
220 C
MAX.
∆T
25°C to 160°C
160°C to 200°C
200°C to 255°C (260°C at 10 seconds max) 4°C/s
255°C to 200°C
200°C to 25°C
P3
200
R4
COOL DOWN
P4
R5
250
Process zone P3 is the solder reflow zone. In zone P3,
the temperature is quickly raised above the liquidus
point of solder to 255°C (491°F) for optimum results. The
dwell time above the liquidus point of solder should be
between 20 and 60 seconds. It usually takes about 20
seconds to assure proper coalescing of the solder balls
into liquid solder and the formation of good solder
connections. Beyond a dwell time of 60 seconds, the
intermetallic growth within the solder connections be-
comes excessive, resulting in the formation of weak and
unreliable connections. The temperature is then rapidly
reduced to a point below the solidus temperature of the
solder, usually 200°C (392°F), to allow the solder within
the connections to freeze solid.
Process zone P4 is the cool down after solder freeze.
The cool down rate, R5, from the liquidus point of the
solder to 25°C (77°F) should not exceed 6°C per second
maximum. This limitation is necessary to allow the PC
board and HSDL-3220 castellations to change dimen-
sions evenly, putting minimal stresses on the HSDL-3220
transceiver.
300
Maximum ∆T/∆time
4°C/s
0.5°C/s
-6°C/s
-6°C/s