TSOP85436 Vishay, TSOP85436 Datasheet - Page 6

• Manufacturer Part Number: TSOP85436
• Manufacturer: Vishay

Specifications of TSOP85436

• Operating Supply Voltage (typ): 3.3/5V
• Operating Supply Voltage (min): 2.5V
• Operating Supply Voltage (max): 5.5V
• Mounting: Surface Mount
• Operating Temperature Classification: Commercial
• Lead Free Status / RoHS Status: Compliant

TSOP852.., TSOP854..
Vishay Semiconductors
PACKAGE DIMENSIONS in millimeters
ASSEMBLY INSTRUCTIONS
Reflow Soldering
• Reflow soldering must be done within 72 h while stored
• Set the furnace temperatures for pre-heating and heating
• Handling after reflow should be done only after the work
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6
under a max. temperature of 30 °C, 60 % RH after
opening the dry pack envelope
in accordance with the reflow temperature profile as
shown in the diagram. Excercise extreme care to keep the
maximum temperature below 260 °C. The temperature
shown in the profile means the temperature at the device
surface. Since there is a temperature difference between
the component and the circuit board, it should be verified
that the temperature of the device is accurately being
measured
surface has been cooled off
Pick and Place area
Drawing-No.: 6.550-5292.01-4
Issue: 3; 19.11.10
20426
(R1.35)
1
1.7 nom
2
1.7 nom.
IR Receiver Modules for Remote
(4.9)
(2.2)
3
8
Marking area
1.7 nom.
Control Systems
4
1.7 nom
(0.6) (5x)
(R1.35)
5
Manual Soldering
• Use a soldering iron of 25 W or less. Adjust the
• Finish soldering within 3 s
• Handle products only after the temperature has cooled off
temperature of the soldering iron below 300 °C
5:1
either on pick and place side or solder pad side
tolerances in the manufacturing process
Proposed pad layout from component side
possible package deviations caused by
Not indicated to lerances ± 0.25
(dim. for reference only)
optional GND pad
connection not necessary
(sideview assembly)
(topview assembly)
0 - 0.1
4 x 1.7 = 6.8
4 x 1.7 = 6.8
technical drawings
according to DIN
specifications
0.8
0.7
(5x)
(5x)
1.7
1.7
Document Number: 81764
Revision: 1.3, 24-Nov-10