PC925L0NIP0F Sharp Electronics, PC925L0NIP0F Datasheet - Page 15
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PC925L0NIP0F
Manufacturer Part Number
PC925L0NIP0F
Description
Manufacturer
Sharp Electronics
Datasheet
1.PC925L0NIP0F.pdf
(20 pages)
Specifications of PC925L0NIP0F
Number Of Elements
1
Input Type
DC
Forward Voltage
1.8V
Forward Current
25mA
Operating Temp Range
-40C to 100C
Power Dissipation
295mW
Propagation Delay Time
500ns
Pin Count
8
Mounting
Surface Mount
Reverse Breakdown Voltage
5V
Operating Temperature Classification
Industrial
Output Type
Push-Pull
Isolation Voltage
5000Vrms
Lead Free Status / RoHS Status
Compliant
■ Manufacturing Guidelines
● Soldering Method
Refl ow Soldering :
Flow Soldering :
Hand soldering
Other notice
Refl ow soldering should follow the temperature profi le shown below.
Soldering should not exceed the curve of temperature profi le and time.
Please don't solder more than twice.
Due to SHARP’s double transfer mold construction submersion in fl ow solder bath is allowed under the be-
low listed guidelines.
Flow soldering should be completed below 270̊C and within 10s.
Preheating is within the bounds of 100 to 150̊C and 30 to 80s.
Please don’t solder more than twice.
Hand soldering should be completed within 3 s when the point of solder iron is below 400̊C.
Please don’t solder more than twice.
Please test the soldering method in actual condition and make sure the soldering works fi ne, since the im-
pact on the junction between the device and PCB varies depending on the tooling and soldering conditions.
(˚C)
300
200
100
0
0
Terminal : 260˚C peak
(package surface : 250˚C peak)
1
Preheat
150 to 180˚C, 120s or less
2
15
3
Reflow
220˚C or more, 60s or less
4
PC925L0NSZ0F Series
(min)
Sheet No.: D4-A09302EN