MCT9001SD Fairchild Semiconductor, MCT9001SD Datasheet - Page 5

Transistor Output Optocouplers 2-CH PHOTOTRANS SMD SMD DIP-8

MCT9001SD

Manufacturer Part Number
MCT9001SD
Description
Transistor Output Optocouplers 2-CH PHOTOTRANS SMD SMD DIP-8
Manufacturer
Fairchild Semiconductor
Datasheet

Specifications of MCT9001SD

Input Type
DC
Output Type
DC
Output Device
Transistor
Number Of Elements
2
Reverse Breakdown Voltage
5V
Forward Voltage
1.3V
Forward Current
60mA
Collector-emitter Voltage
55V
Package Type
PDIP W SMD
Collector Current (dc) (max)
30mA
Isolation Voltage
5300Vrms
Power Dissipation
400mW
Collector-emitter Saturation Voltage
0.4V
Current Transfer Ratio
600%
Pin Count
8
Mounting
Surface Mount
Operating Temp Range
-55C to 100C
Operating Temperature Classification
Industrial
Configuration
2 Channel
Maximum Collector Emitter Voltage
55 V
Maximum Collector Emitter Saturation Voltage
0.4 V
Maximum Forward Diode Voltage
1.3 V
Maximum Collector Current
30 mA
Maximum Power Dissipation
400 mW
Maximum Operating Temperature
+ 100 C
Minimum Operating Temperature
- 55 C
Package / Case
PDIP-8 Gull Wing
Maximum Input Diode Current
60 mA
Maximum Reverse Diode Voltage
5 V
Lead Free Status / RoHS Status
Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MCT9001SD
Manufacturer:
ON
Quantity:
14 000
Part Number:
MCT9001SD
Manufacturer:
FAIRCHILD/仙童
Quantity:
20 000
©2003 Fairchild Semiconductor Corporation
MCT9001 Rev. 1.0.7
Package Dimensions
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or
obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions,
specifically the warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/
6.00~7.00
2.30~3.30
Note:
All dimensions are in millimeters.
(Typ.)
Through Hole
0.4" Lead Spacing
4.50
6.00~7.00
(Typ.)
4.60
3.00~4.00
3.00~4.00
(Typ.)
1.00
(Typ.)
1.10
2.29~2.79
0.40~0.60
9.18~10.18
9.18~10.18
1.15~1.35
2.29~2.79
0.40~0.60
1.15~1.35
2.30~3.30
Pin 1
(0.405)
Pin 1
(0.405)
(Max.)
15
(Max.)
15
7.62 (Typ.)
10.16 (Typ.)
0.26 (Typ.)
0.26 (Typ.)
5
6.00~7.00
3.85
Typ.
Surface Mount
Recommend Pad Layout for Surface
Mount Leadform
0.35
Typ.
3.00~4.00
(1.30)
2.29~2.79
9.18~10.18
1.15~1.35
(1.50)
0.40~0.60
(1.04)
Pin 1
(0.405)
0.75~1.25
(Both sides
(7.90)
(2.54)
9.86~10.46
8.15 (Typ.)
(10.50)
www.fairchildsemi.com
0.26 Typ.

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