LE3100MICH S L8YC Intel, LE3100MICH S L8YC Datasheet - Page 6
![no-image](/images/manufacturer_photos/0/3/336/intel_sml.jpg)
LE3100MICH S L8YC
Manufacturer Part Number
LE3100MICH S L8YC
Description
Manufacturer
Intel
Datasheet
1.LE3100MICH_S_L8YC.pdf
(106 pages)
Specifications of LE3100MICH S L8YC
Mounting
Surface Mount
Lead Free Status / RoHS Status
Compliant
Tables
6
1-1 References ..............................................................................................................11
2-1 Voltage Identification Definition .................................................................................15
2-2 Absolute Maximum and Minimum Ratings ....................................................................17
2-3 Voltage and Current Specifications..............................................................................18
2-4 Processor V
2-5 V
2-6 FSB Signal Groups ....................................................................................................22
2-7 Signal Characteristics................................................................................................23
2-8 Signal Reference Voltages .........................................................................................23
2-9 GTL+ Signal Group DC Specifications ..........................................................................23
2-10Open Drain and TAP Output Signal Group DC Specifications ...........................................24
2-11CMOS Signal Group DC Specifications .........................................................................24
2-12PECI DC Electrical Limits ...........................................................................................25
2-13GTL+ Bus Voltage Definitions .....................................................................................25
2-14Core Frequency to FSB Multiplier Configuration.............................................................26
2-15BSEL[2:0] Frequency Table for BCLK[1:0] ...................................................................27
2-16Front Side Bus Differential BCLK Specifications .............................................................28
2-17FSB Differential Clock Specifications (1333 MHz FSB) ....................................................28
3-1 Processor Loading Specifications.................................................................................36
3-2 Package Handling Guidelines......................................................................................36
3-3 Processor Materials ...................................................................................................37
4-1 Alphabetical Land Assignments...................................................................................42
4-2 Numerical Land Assignment .......................................................................................58
4-3 Signal Description.....................................................................................................70
5-1 Processor Thermal Specifications ................................................................................78
5-2 Processor Thermal Profile (65 W)................................................................................79
5-3 Processor Thermal Profile (45W).................................................................................79
5-4 GetTemp0() Error Codes ...........................................................................................86
6-1 Power-On Configuration Option Signals .......................................................................87
7-1 Fan Heatsink Power and Signal Specifications ...............................................................97
7-2 Fan Heatsink Power and Signal Specifications ............................................................. 100
CC
Overshoot Specifications......................................................................................20
CC
Static and Transient Tolerance ...............................................................19
Datasheet