VNN1NV04 STMicroelectronics, VNN1NV04 Datasheet - Page 17

• Manufacturer Part Number: VNN1NV04
• Manufacturer: STMicroelectronics

Specifications of VNN1NV04

• Lead Free Status / RoHS Status: Not Compliant

VND1NV04 - VNN1NV04 - VNS1NV04
4
4.1
Package and PCB thermal data
DPAK thermal data
Figure 30. DPAK PC board
1. Layout condition of R
Figure 31. DPAK R
Cu thickness=35 µm , Copper areas: from minimum pad layout to 16 cm
90
80
70
60
50
40
30
0
footprint
th
thj-amb
PCB Cu heat sink area ( cm^ 2) - ( refer t o PCB layout )
and Z
2
th
measurements (PCB FR4 area = 58 mm x 58 mm,PCB thickness = 2 mm,
vs. PCB copper area in open box free air condition
Doc ID 7381 Rev 2
4
6
Package and PCB thermal data
2
).
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