XC56309AG100A Freescale, XC56309AG100A Datasheet - Page 35

• Manufacturer Part Number: XC56309AG100A
• Manufacturer: Freescale

Specifications of XC56309AG100A

• Device Core Size: 24b
• Format: Fixed Point
• Clock Freq (max): 100MHz
• Mips: 100
• Device Input Clock Speed: 100MHz
• Ram Size: 102KB
• Operating Supply Voltage (typ): 3.3V
• Operating Supply Voltage (min): 3V
• Operating Supply Voltage (max): 3.6V
• Operating Temp Range: -40C to 100C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 144
• Package Type: LQFP
• Lead Free Status / RoHS Status: Compliant

2.5.5.2 DRAM Timing
The selection guides in Figure 2-14 and Figure 2-17 are for primary selection only. Final selection should be based
on the timing in the following tables. For example, the selection guide suggests that four wait states must be used
for 100 MHz operation with Page Mode DRAM. However, consulting the appropriate table, a designer can evaluate
whether fewer wait states might suffice by determining which timing prevents operation at 100 MHz, running the
chip at a slightly lower frequency (for example, 95 MHz), using faster DRAM (if it becomes available), and
manipulating control factors such as capacitive and resistive load to improve overall system performance.
Freescale Semiconductor
DRAM type
(tRAC ns)
100
80
70
60
Figure 2-14.
50
1 Wait states
2 Wait states
40
DSP56309 Technical Data, Rev. 7
DRAM Page Mode Wait State Selection Guide
Note:
66
This figure should be used for primary selection. For exact
and detailed timings, see the following tables.
80
100
3 Wait states
4 Wait states
120
Chip frequency
(MHz)
AC Electrical Characteristics
2-15