A80960JF3V33819542 Intel, A80960JF3V33819542 Datasheet - Page 65

• Manufacturer Part Number: A80960JF3V33819542
• Manufacturer: Intel

Specifications of A80960JF3V33819542

• Family Name: i960
• Device Core Size: 32b
• Frequency (max): 33MHz
• Instruction Set Architecture: RISC
• Supply Voltage 1 (typ): 3.3V
• Operating Supply Voltage (max): 3.45V
• Operating Supply Voltage (min): 3.15V
• Operating Temp Range: 0C to 100C
• Operating Temperature Classification: Commercial
• Mounting: Through Hole
• Pin Count: 132
• Package Type: CPGA
• Lead Free Status / RoHS Status: Compliant

Datasheet
Table 35. 80960JS/JC/JT 196-Ball MPBGA Package Thermal Characteristics
Table 36. 132-Lead PQFP Package Thermal Characteristics
NOTES:
NOTES:
1. This table applies to an MPBGA device soldered directly into a board with all V
2.
1. This table applies to a PQFP device soldered directly into board.
2.
3.
4.
JC
CA
JC
CA
(Junction-to-Case)
(Junction-to-Case)
(Case-to-Ambient) (No Heatsink)
(Case-to-Ambient -No Heatsink)
JA
JA
JL
JB
= 13° C/W (approx.)
=
=
= 13.5° C/W (approx.)
JC
JC
Parameter
+
+
CA
CA
Parameter
80960JA/JF/JD/JS/JC/JT 3.3 V Embedded 32-Bit Microprocessor
Thermal Resistance — °C/Watt
Thermal Resistance — °C/Watt
4.1
(0)
23
0
JA
(0.25)
JB
JA
4.3
50
19
(0)
34
0
2
JC
JC
Airflow — ft./min (m/sec)
(0.50)
JL
CA
100
4.3
18
(1.01)
200
25
2
Airflow — ft./min (m/sec)
CA
(1.01)
200
4.3
16
(2.03)
400
23
2
(2.03)
400
SS
4.3
14
(3.04)
600
22
2
connections.
(3.04)
600
4.7
11
(4.06)
800
21
2
(4.06)
800
4.9
(5.08)
1000
9
20
2
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