MCIMX257DJM4A Freescale, MCIMX257DJM4A Datasheet - Page 20

no-image

MCIMX257DJM4A

Manufacturer Part Number
MCIMX257DJM4A
Description
Manufacturer
Freescale
Datasheet

Specifications of MCIMX257DJM4A

Operating Temperature (min)
-20C
Operating Temperature (max)
70C
Operating Temperature Classification
Commercial
Mounting
Surface Mount
Lead Free Status / RoHS Status
Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MCIMX257DJM4A
Manufacturer:
Piecemakers
Quantity:
101
Part Number:
MCIMX257DJM4A
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
3.5
This section includes the DC parameters of the following I/O types:
3.5.1
The DDR pad type is configured by the IOMUXC_SW_PAD_CTL_GRP_DDRTYPE register (see the
External Signals and Pin Multiplexing chapter of the i.MX25 Reference Manual for details).
20
1
2
3
4
Junction to ambient
Junction to ambient
Junction to boards
Junction to case (top)
Junction to package top
Junction-to-ambient thermal resistance determined per JEDC JESD51-3 and JESD51-6. Thermal test board meets JEDEC
specification for this package.
Junction-to-board thermal resistance determined per JEDC JESD51-8. Thermal test board meets JEDEC specification for
this package.
Junction-to-case at the top of the package determined using MIL-STD 883 Method 1012.1. The cold plate temperature is
used for the case temperature. Reported value includes the thermal resistance of the interface layer.
Thermal characterization parameter indicating the temperature difference between the package top and the junction
temperature per JEDEC JESD51-2. When Greek letters are not available, this thermal characterization parameter is written
as Psi-JT.
DDR I/O: Mobile DDR (mDDR), double data rate (DDR2), or synchronous dynamic random
access memory (SDRAM)
General purpose I/O (GPIO)
I/O DC Parameters
DDR I/O DC Parameters
The term ‘OVDD’ in this section refers to the associated supply rail of an
input or output. The association is shown in the “Signal Multiplexing”
chapter of the reference manual.
2
1
1
i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 6
(@200 ft/min)
(@200 ft/min)
3
Rating
4
Table 14. Thermal Resistance Data (continued)
Single layer board (1s)
Four layer board (2s2p)
Natural convection
NOTE
Condition
Symbol
R
R
R
R
eJCtop
eJMA
eJMA
eJB
JT
Freescale Semiconductor
Value
46
29
22
13
2
°C/W
°C/W
°C/W
°C/W
°C/W
Unit

Related parts for MCIMX257DJM4A